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iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging

 

New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on experience with the most similar technology previously qualified. Doing so, however, does not take into account the characteristics of new technologies and may result in overlooking new failure modes. At the same time, there is a general lack of understanding of the assembly processes, application environments, and use conditions in which the new package technologies will be used. This information gap poses challenges when developing the appropriate reliability test plans for new package technologies and materials.

iNEMI
By iNEMI
on Sep 19, 2019 11:56:25 AM
   
iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging

 

New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on...

iNEMI
By iNEMI
on Sep 19, 2019 11:56:25 AM
iNEMI Workshop Identifies Drivers and Needs for Next-Generation Solder Materials

iNEMI’s Next-Generation Solder Materials workshop brought together more than 70 industry professionals from across the...

iNEMI
By iNEMI
on May 2, 2019 8:06:58 AM
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