PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components
The iNEMI PCBA Cleanliness Project recently completed a study on the impact of cleanliness on PCBAs with bottom-terminated...
iNEMI Warpage Characterization Project Accumulates Warpage Data to Assist Manufacturers in the Design of Next-Generation Packaging
The ability to predict and manage package warpage at an early stage of product development is critical to ensure product yield...
iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging
New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on...
iNEMI Workshop Identifies Drivers and Needs for Next-Generation Solder Materials
iNEMI’s Next-Generation Solder Materials workshop brought together more than 70 industry professionals from across the...
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