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PCB reliability

PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components

The iNEMI PCBA Cleanliness Project recently completed a study on the impact of cleanliness on PCBAs with bottom-terminated components (BTCs). Focusing specifically on QFNs, the team evaluated different materials and test methods to identify key factors affecting reliability and evaluate trade-offs between cleanliness and performance. 
iNEMI
By iNEMI
on November 27, 2019 12:01:47 PM EST
   
PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components
The iNEMI PCBA Cleanliness Project recently completed a study on the impact of cleanliness on PCBAs with bottom-terminated...
iNEMI
By iNEMI
on November 27, 2019 12:01:47 PM EST
iNEMI Warpage Characterization Project Accumulates Warpage Data to Assist Manufacturers in the Design of Next-Generation Packaging

The ability to predict and manage package warpage at an early stage of product development is critical to ensure product yield...

iNEMI
By iNEMI
on November 27, 2019 11:45:54 AM EST
iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging

 

New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on...

iNEMI
By iNEMI
on September 19, 2019 11:56:00 AM EDT
iNEMI Workshop Identifies Drivers and Needs for Next-Generation Solder Materials

iNEMI’s Next-Generation Solder Materials workshop brought together more than 70 industry professionals from across the...

iNEMI
By iNEMI
on May 2, 2019 8:06:58 AM EDT
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