iNEMI Project Reports Benchmark New and Emerging Test and Measurement Methodologies for 5G/mmWave Materials
The transition of 4G LTE based communication to 5G/mmWave-based protocols is expected to drive disruptive changes in the...
iNEMI Team Develops Test to Expedite Evaluation of Conformal Coatings
Conformal coatings are used in electronics assemblies to protect printed circuit boards and components mounted on them from the...
Upcoming iNEMI Projects and Initiatives Offer Opportunities to Get Involved
2020 has proved a very successful and productive year for iNEMI project teams. By the end of the year 5 projects will have been...
iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19
iNEMI recently published “Recommended Best Practices for Protecting the Reliability and Integrity of Electronic Products and...
Combined Efforts of iNEMI Projects Help Industry Quantify the Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior
iNEMI PCB Technology Forum at APEX Focused on Emerging Challenges & Technology Needs
iNEMI Project is Analyzing Inspection Capabilities for Fine Pitch Substrates
Electronic packaging technologies are quickly moving to adopt heterogeneous integrated solutions. However, the fine lines and...
PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components
iNEMI Warpage Characterization Project Accumulates Warpage Data to Assist Manufacturers in the Design of Next-Generation Packaging
The ability to predict and manage package warpage at an early stage of product development is critical to ensure product yield...
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