Subscribe to Email Updates

Latest Blog Post

Packaging Innovation Maintains the Pace of Progress as Moore’s Law Scaling Slows

The 2017 iNEMI Roadmap includes a chapter on packaging and component substrates. This chapter is intended to provide focus and direction to industry, academia and government on critical technology trends and motivations for research needed to meet next-generation packaging requirements.

As demonstrated by the roadmap, the vision for electronics serving society is changing dramatically with four primary factors driving those changes: (1) the rise of the Internet of things; (2) migration of data, logic and applications to the cloud; (3) the consumerization of data generation and data access; and (4) packaging as a key to maintaining the “Moore’s Law” pace of progress.

W. R. (Bill) Bottoms
By W. R. (Bill) Bottoms
on Aug 9, 2017 11:26:48 AM
   
Packaging Innovation Maintains the Pace of Progress as Moore’s Law Scaling Slows

The 2017 iNEMI Roadmap includes a chapter on packaging and component substrates. This chapter is intended to provide focus and...

W. R. (Bill) Bottoms
By W. R. (Bill) Bottoms
on Aug 9, 2017 11:26:48 AM
Written by

Leave a comment