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Proposed Projects in Eco-Design and Extended Reliability Help Promote a Circular Economy in Electronics Manufacturing

iNEMI hosted a virtual workshop — Promoting a Circular Economy through Best Practices in Eco-Design and a Standardized Procedure for Extended Reliability Assessment — as part of this year’s Electronics Goes Green (EGG) conference. The workshop, moderated by Tom Okrasinski (Nokia Bell Labs), focused on two key areas identified by iNEMI members as opportunities for supporting the realization of a circular electronics economy: innovative eco-design and extended reliability potential of Circular economyelectronic systems.
iNEMI
By iNEMI
on September 17, 2020 8:29:26 PM EDT
   
iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19

iNEMI recently published “Recommended Best Practices for Protecting the Reliability and Integrity of Electronic Products and...

iNEMI
By iNEMI
on September 17, 2020 8:29:06 PM EDT
Combined Efforts of iNEMI Projects Help Industry Quantify the Impact of Low Temperature Solder on Electronic Package Dynamic Warpage Behavior
Adoption of low temperature solder (LTS) has increased over the years. The fundamentals of dynamic warpage are well established...
iNEMI
By iNEMI
on September 17, 2020 8:28:41 PM EDT
Impact of PCB Manufacturing, Design and Material on PCB Warpage

The smaller form factors and finer pitches found in today’s electronic products are driving the use of smaller components and...

Antonio Caputo, Intel
By Antonio Caputo, Intel
on June 25, 2020 10:29:38 PM EDT
iNEMI Project Recommends Methodology for Qualifying New Packaging Technologies
Several recent developments in the electronics manufacturing supply chain are posing challenges for companies needing to...
Curtis Grosskopt & Feng Xue, IBM
By Curtis Grosskopt & Feng Xue, IBM
on June 25, 2020 10:27:22 PM EDT
iNEMI PCB Technology Forum at APEX Focused on Emerging Challenges & Technology Needs
 
IPC APEX EXPO 2020 was a great location for iNEMI’s PCB-focused workshop....
iNEMI
By iNEMI
on March 26, 2020 3:22:20 PM EDT
iNEMI Project is Analyzing Inspection Capabilities for Fine Pitch Substrates

Electronic packaging technologies are quickly moving to adopt heterogeneous integrated solutions. However, the fine lines and...

iNEMI
By iNEMI
on March 26, 2020 1:32:24 PM EDT
PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components
The iNEMI PCBA Cleanliness Project recently completed a study on the impact of cleanliness on PCBAs with bottom-terminated...
iNEMI
By iNEMI
on November 27, 2019 12:01:47 PM EST
iNEMI Warpage Characterization Project Accumulates Warpage Data to Assist Manufacturers in the Design of Next-Generation Packaging

The ability to predict and manage package warpage at an early stage of product development is critical to ensure product yield...

iNEMI
By iNEMI
on November 27, 2019 11:45:54 AM EST
iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging

 

New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on...

iNEMI
By iNEMI
on September 19, 2019 11:56:00 AM EDT
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