PCBA Cleanliness Project Studies Impact of Cleanliness on Reliability of Bottom Terminated Components
The iNEMI PCBA Cleanliness Project recently completed a study on the impact of cleanliness on PCBAs with bottom-terminated...
iNEMI Warpage Characterization Project Accumulates Warpage Data to Assist Manufacturers in the Design of Next-Generation Packaging
The ability to predict and manage package warpage at an early stage of product development is critical to ensure product yield...
iNEMI Project Focuses on Methodologies for Qualifying New Electronic Device Packaging
New integrated circuit (IC) package technologies are typically qualified using procedures and test conditions based on...
iNEMI Workshop Identifies Drivers and Needs for Next-Generation Solder Materials
iNEMI’s Next-Generation Solder Materials workshop brought together more than 70 industry professionals from across the...
iNEMI Team Develops Reuse and Recycling Metric
If you can’t measure it, you can’t manage it!
After evaluating existing recyclability and reusability metrics, the iNEMI...
Demonstrating a Circular Economy
Making hard drives from hard drives
Mitigating Creep Corrosion with Effective Test
Creep corrosion is a common mode of corrosion-related failure. It occurs when metallization corrodes and the corrosion...
Value Recovery from Hard Disk Drives
The following is excerpted from “Value Recovery from Hard Disk Drives,” published by Forbes.com on July 13, 2018.
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