As the electronics industry continues its dramatic changes and 5G/IoT devices and applications become more prevalent, innovative ceramic interconnection substrate technology is becoming a key enabler. Few material technologies can operate at 5G frequencies and up to 80 GHz. The high-frequency, microwave and electrical performance of low-temperature co-fired ceramics (LTCC) can support these requirements.
Ceramic substrates offer a tool set that will enable adopters to realize a competitive advantage through increased functionality, 3D integration, and portability demanded by 5G electronic systems packaging requirements.
As the electronics industry continues its dramatic changes and 5G/IoT devices and applications become more prevalent,...
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