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Archive February 2024

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Seminar Highlights Technical Challenges for Humidity Robustness and Insulation Performance in Automotive Electronics

By: iNEMI
On: 02/29/2024 21:05:11
In: iNEMI Blog

Recap of the iNEMI / ZESTRON seminar held February 1, 2024, in Ingolstadt, Germany.

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Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

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iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

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Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

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Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering

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