iNEMI Publishes Organic PCB and Power Conversion Electronics Chapters from the 2019 Roadmap
Chapters from the 2019 Roadmap
MORRISVILLE, NC (September 24, 2019) — The International Electronics Manufacturing Initiative (iNEMI) today announced the publication of the Organic PCB and Power Conversion Electronics chapters of the 2019 Roadmap.
Both of these Technology Working Group (TWG) chapters identify key technology developments anticipated and required within the supply chain to meet product needs between now and 2029 in their respective technology areas. The chapters also identify any potential gaps between product sector needs and technology capabilities.
New products will require, for example, advanced packaging and heterogeneous integration, new materials, and innovative architectures. Organic PCB developments must comprehend these changing market demands. Power conversion electronics topics include device-level considerations through power supply technologies that are needed to either extend or improve within the roadmap time horizon.
Organic PCB — Organic printed circuit boards (PCBs) provide many functional attributes for today's electronic devices. While the development of new structures and materials present new opportunities to meet product needs, there are challenges and technology gaps that must be identified and resolved. This chapter discusses rigid, flexible and optoelectronic substrates; manufacturing equipment and processes; materials currently available; and includes projections of challenges over the next 10 years. It also presents critical issues with regards to embedded components, computer buses, package conductor routing, and liquid coolants and heat sink requirements.
Power Conversion Electronics — Dramatic changes in the power semiconductor space are enabling and enhancing power conversion technologies in applications such as computing, consumer products, and telecommunications. This chapter, which was developed in conjunction with the Power Supply Manufacturers Association (PSMA), discusses dominant power conversion trends and challenges, along with metrics in their respective end segments, providing a comprehensive view of power conversion needs. A combined qualitative and quantitative picture is presented of key technologies and trends in the four representative power converter technologies (AC-DC front-end power supplies, AC-DC external power supplies, isolated DC-DC power supplies, and non-isolated DC-DC power supplies).
The 2019 Roadmap is now available on the iNEMI website. It is free to iNEMI members; pricing information for non-members is available online at https://www.inemi.org/2019-roadmap-overview
For the 2019 Roadmap, chapters are being published in waves, with new chapters released every two to three weeks. The first three waves, already available online, included the following 12 chapters: Aerospace & Defense; Board Assembly; High-End Systems; Industrial Internet of Things; Mass Data Storage; Medical; MEMS & Sensors; Modeling, Simulation & Design Tools; Optoelectronics; Semiconductor Technologies; Smart Manufacturing; and Sustainable Electronics.
The International Electronics Manufacturing Initiative's mission is to forecast and accelerate improvements in the electronics manufacturing industry for a sustainable future. The consortium is made up of more than 90 manufacturers, suppliers, industry associations and consortia, government agencies, research institutes and universities. iNEMI roadmaps the needs of the electronics industry, identifies gaps in the technology infrastructure, executes collaborative projects to eliminate these gaps (both business and technical) and stimulates standards activities to speed the introduction of new technologies. The consortium also works with government agencies, universities and other funding agencies to set priorities for future industry needs and R&D initiatives. iNEMI is based in Morrisville, North Carolina. For additional information about iNEMI, visit http://www.inemi.org.
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