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iNEMI Project Will Focus on Moisture Induced Expansion Metrology

New iNEMI project to provide experiment-based assessment of metrology options for characterization of materials expansion and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits.
iNEMI's new Moisture Induced Expansion Metrology for Packaging Polymetric Materials Project will give materials companies a better understanding of quantifiable material properties at higher temperatures and moisture concentrations to enable them to develop innovative new materials that minimize the risk of failure due to moisture and humidity.

Background

Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.  

Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. Hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).  

Project Focus

This project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits. The team will:
  • Evaluate methodologies of material expansion 
  • Evaluate packaging materials (polymer materials)
  • Apply measurement methods for material selection
  • Conduct fundamental studies of material characterization
In Phase 2, the project team plans to evaluate the various polymetric materials used in packaging as well as packages. If you are interested in participating in this project or had any questions, please contact Masahiro Tsuriya (m.tsuriya@inemi.org). For additional information (including presentation and recording from our recent call-for-participation webinar).