iNEMI Project Will Focus on Moisture Induced Expansion Metrology
Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.
Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. Hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).
This project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits. The team will:
- Evaluate methodologies of material expansion
- Evaluate packaging materials (polymer materials)
- Apply measurement methods for material selection
- Conduct fundamental studies of material characterization