Workshop on Reliability Challenges and Solutions for Automotive Electronics
The iNEMI workshop — Reliability Challenges and Solutions for Automotive Electronics — hosted by ZESTRON/Shanghai in October generated excellent discussion about reliability issues and concerns related to electronics used in automobiles. The workshop focused on reliability challenges, possible solutions for those challenges and gaps that require industry attention.
Workshop Identifies Need for Common Specifications and Cross-Industry Collaboration
Speaker presentations to the whole group were followed up with break-out group discussions to focus on issues related to material component assembly, process quality manufacturing and design test standards.
Major concerns raised by attendees are around the need to align industry standards, especially since some of the standards for electronics manufacturing were not initially defined for automotive applications. In addition, there is a lack of historical data to build reliability models and correlate them with failure modes in final vehicle operating environments. Participants also highlighted large LGA modules, packages such as QFN, QFP and BGA, extremely small 0201 01005 packages, and high-voltage connectors as areas of concern.
Cross-industry communication and collaboration between the electronics and automotive supply chains was identified as necessary to close knowledge gaps and establish common specifications for automotive applications. iNEMI will review the issues and suggestions raised at the workshop and look into follow-up activities, including potential projects. Contact Haley Fu (firstname.lastname@example.org) to get involved in follow-up discussions and planning. Workshop presentations are available to members.
Thank You to Our Hosts
A special thanks to the ZESTRON North Asia team for hosting and helping coordinate this successful event.