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Blog
Profile: iNEMI
This is my bio.
- Login Count: 1048
- Join Date: 02/04/2008 11:27:52
- Last on: 12/08/2011 15:18:51
- Website: http://www.timberlakepublishing.com
- Location: Fairfax, VA
- Articles posted by this author:
- Outstanding Technical Paper Award Presented to Two iNEMI Papers at ICEP
- CEO Shekhar Chandrashekhar talks to RealTime with IPC APEX EXPO
- The Year in Review: A Message from the CEO
- Technology Roadmapping: Observations from InterPACK
- Workshop on Reliability Challenges and Solutions for Automotive Electronics
- iNEMI Recognizes Accomplishments of Project Teams
- iNEMI Receives Grant from NIST’s Advanced Manufacturing Technology Roadmap Program to Develop 5G/6G Roadmap
- Predicting the Future is a Perilous Business
- iNEMI Announces Board of Directors Election Results
- Industry Survey Helps iNEMI Identify Collaborations for Smart Manufacturing
- Video Series Shares Innovative Eco-Design Practices for a Circular Electronics Economy
- iNEMI Rolls Out Phase 1 of New Awards & Recognition Program
- Inspection and Reliability Study of Voids in First-Level Interconnects for Flip Chip Packages
- iNEMI Project Will Focus on Moisture Induced Expansion Metrology
- iNEMI Launching Project on Electromigration of SnBi Solder for Second-Level Interconnect
- iNEMI Team Reports Results of Post Mechanical Shock Test Failure Analysis of Mixed SnAgCu-BiSn BGA Solder Joints
- IPC and iNEMI Sign Memorandum of Understanding, Strengthening Collaboration Focused on the Future of Electronics Manufacturing
- iNEMI and SMTA co-host two webinars on Pb-free solder developments
- iNEMI Presentations at SMTAI 2019
- iNEMI Publishes Best Practices for Protecting the Reliability and Integrity of Electronic Equipment when Disinfecting for COVID-19
- Intel’s Mostafa Aghazadeh Elected Chairman of iNEMI’s Board
- iNEMI Announces Board of Directors Election Results
- iNEMI Publishes Flexible Hybrid Electronics, Organic PCB and Portable & Wireless Roadmap Chapters
- Latest iNEMI Roadmap Chapters Cover Ceramic Interconnect & Photovoltaics, Connectors, and Passive Components
- iNEMI Publishes Organic PCB and Power Conversion Electronics Chapters from the 2019 Roadmap
- iNEMI’s Value Recovery Project Demonstrates a Circular Economy for Hard Disk Drives
- iNEMI Publishes Product Sector Chapters from the 2019 Roadmap
- iNEMI Publishes Organic PCB and Power Conversion Electronics Chapters from the 2019 Roadmap
- iNEMI Announces Publication of Wave 1 of the 2019 Roadmap
- Presentations: iNEMI and AIM Academy Meetings at OFC 2018
- iNEMI Interviews at APEX 2018
- iNEMI at SMTAI 2017
- iNEMI Names New Roadmap Manager
- INEMI PROJECT REPORTS BENCHMARK NEW AND EMERGING TEST AND MEASUREMENT METHODOLOGIES FOR 5G/MMWAVE MATERIALS
- iNEMI Team Develops Test to Expedite Evaluation of Conformal Coatings
- UPCOMING INEMI PROJECTS AND INITIATIVES OFFER OPPORTUNITIES TO GET INVOLVED
- PROPOSED PROJECTS IN ECO-DESIGN AND EXTENDED RELIABILITY HELP PROMOTE A CIRCULAR ECONOMY IN ELECTRONICS MANUFACTURING
- INEMI PUBLISHES BEST PRACTICES FOR PROTECTING THE RELIABILITY AND INTEGRITY OF ELECTRONIC EQUIPMENT WHEN DISINFECTING FOR COVID-19
- COMBINED EFFORTS OF INEMI PROJECTS HELP INDUSTRY QUANTIFY THE IMPACT OF LOW TEMPERATURE SOLDER ON ELECTRONIC PACKAGE DYNAMIC WARPAGE BEHAVIOR
- IMPACT OF PCB MANUFACTURING, DESIGN AND MATERIAL ON PCB WARPAGE
- INEMI PROJECT RECOMMENDS METHODOLOGY FOR QUALIFYING NEW PACKAGING TECHNOLOGIES
- INEMI PCB TECHNOLOGY FORUM AT APEX FOCUSED ON EMERGING CHALLENGES & TECHNOLOGY NEEDS
- INEMI PROJECT IS ANALYZING INSPECTION CAPABILITIES FOR FINE PITCH SUBSTRATES
- PCBA CLEANLINESS PROJECT STUDIES IMPACT OF CLEANLINESS ON RELIABILITY OF BOTTOM TERMINATED COMPONENTS
- INEMI WARPAGE CHARACTERIZATION PROJECT ACCUMULATES WARPAGE DATA TO ASSIST MANUFACTURERS IN THE DESIGN OF NEXT-GENERATION PACKAGING
- INEMI PROJECT FOCUSES ON METHODOLOGIES FOR QUALIFYING NEW ELECTRONIC DEVICE PACKAGING
- INEMI’S VALUE RECOVERY PROJECT DEMONSTRATES A CIRCULAR ECONOMY FOR HARD DISK DRIVES
- INEMI WORKSHOP IDENTIFIES DRIVERS AND NEEDS FOR NEXT-GENERATION SOLDER MATERIALS
- INEMI PROJECT DEVELOPS REUSE AND RECYCLING METRIC TO ASSESS CIRCULAR ECONOMIC VALUE OF ICT PRODUCTS
- INEMI TEAM DEVELOPS REUSE AND RECYCLING METRIC
- DEMONSTRATING A CIRCULAR ECONOMY
- MITIGATING CREEP CORROSION WITH EFFECTIVE TEST
- VALUE RECOVERY FROM HARD DISK DRIVES
- THE PROCESS OF DEVELOPING A ROADMAP PROVIDES VALUE TO THE ORGANIZATIONS INVOLVED
- FLEXIBLE HYBRID ELECTRONICS KEY TO A PERSONALIZED DIGITAL FUTURE
- PACKAGING INNOVATION MAINTAINS THE PACE OF PROGRESS AS MOORE’S LAW SCALING SLOWS
- INEMI ROADMAP POINTS TO CERAMIC TECHNOLOGY AS A KEY ENABLER FOR 5G DEVICES
- MASS DATA STORAGE ROADMAP POINTS TO FURTHER GROWTH IN NAND AS WELL AS HDD, TAPE AND OPTICAL TECHNOLOGIES
- ECO-DESIGN: A 20-YEAR FORECAST FROM THE 2017 INEMI ROADMAP
- IOT IS A REVOLUTIONARY FORCE IN MANY AREAS
- BUILDING A CIRCULAR ECONOMY IN THE ELECTRONICS INDUSTRY
- ROI ON COLLABORATION
- SETTING PRIORITIES IS CRITICAL TO LEVERAGING LIMITED FUNDS
- HOW COLLABORATION IMPROVES YOUR CUSTOMERS' EXPERIENCE
- 9 STEPS TO BUILDING STRATEGIC INDUSTRY PARTNERSHIPS
- HOW TO USE INDUSTRY ROADMAPS TO IMPROVE INTERNAL INNOVATION
- IMPROVING PRODUCT QUALITY THROUGH COLLABORATIVE PROBLEM SOLVING
- WHY R&D IS MORE SUCCESSFUL WITH COLLABORATION
- WHY COLLABORATIVE INNOVATION ISN’T RISKY
- WHY GREEN ELECTRONICS ARE MORE IMPORTANT THAN EVER
- WHAT’S AHEAD FOR AUTOMOTIVE ELECTRONICS
- RECYCLING ELECTRONICS ALONE WON’T SAVE THE PLANET (OR MAKE YOU RICH)
- CHALLENGES FOR MEDICAL ELECTRONICS MANUFACTURING
- DETERMINING THE ROI OF COLLABORATIVE INNOVATION & PROBLEM SOLVING
- THE NEED FOR CONSISTENCY ACROSS CONNECTOR RELIABILITY TESTS
- 5 REASONS WHY YOUR COMPANY SHOULD COLLABORATE TO SOLVE PROBLEMS
- iNEMI Releases Guidelines to Reduce Risk of Creep Corrosion
- test
- Example Blog Article 2
- Example Blog Article 1