Presentations for Board Assembly & Test Technology Workshop (for members only)

These are presentations from the iNEMI Board Assembly & Test Technology Workshop (August 25-26, 2014).
These presentations are available to workshop attendees and iNEMI members only.  If you are an iNEMI member, please log into or create a web account to view.  If you attended the workshop and need access, please contact
Workshop Overview
Haley Fu, iNEMI
iNEMI Roadmap on Board Assembly & Test
Bill Bader, iNEMI
Telecom Products Manufacturing Challenge Driven by Components
Xiaodong Jiang, Alcatel-Lucent
Assembly Technology Challenges for Server Systems
Wayne Zhang, IBM
3D Packaging Solutions with Flip Chip and Fan-out Wafer Level Technology Driving Performance and Cost Innovation
Ming-Che Hsieh, STATS ChipPAC
High Reliability Solder Alloy Solutions
Forrest Lin, Henkel
Effect of Sn Grain Morphology on Reliability of Lead Free Solder Joints in Thermal Cycling Tests
Babak Arfaei, Universal Instruments
System Reliability Design & Validation
Jason Jiang, Lenovo
Automotive Electronics Modules Assembly & Testing -- Complexity & Cost Challenges
Ravi Phadke, Delphi
High Density Interconnect Necessitates Board Test Innovation
N. K. Chari, Keysight Technologies (Agilent)
Board Test Automation, Productivity and Economics
Jacky Wang, Teradyne
Development of Low Temp Drop Shock Resistant Allow for Hand Held Devices
Andy Yuen, Alpha (Alent)
The Impact of Component Warping to Assembly Process Resulting to Head in Pillow and Non Wet Open Defects
Ranilo Aranda, Flextronics
Dispensing Methods and Requirements for Manufacturing of Mobile and Wearable Electronics
Mani Ahmadi, Nordson AT Electronic Systems
Group Discussion Outputs
Breakout groups