Event Calendar

Tuesday, January 18, 2022

Call-for-Participation: Moisture Induced Expansion Metrology for Packaging Polymetric Materials, Session 1

Date(s): January 18, 2022

Time: 10:00 AM  JST - 11:00 AM  JST

Session 1 (APAC/Americas)
Tuesday, January 18
10:00-11:00 a.m. JST (Japan)
8:00-9:00 p.m. EST (Americas) on Monday, January 17 
Register for this webinar 


Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.  

Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. However, hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).  

Phase 1 of the Moisture Induced Expansion Metrology for Packaging Polymetric Materials project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits.  Join iNEMI for this call-for-participation webinar to learn more about this new project.


Session 2 (Americas/Europe/APAC) 
Tuesday, January 18 
8:00-9:00 a.m. EST (Americas) 
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan) 
Register for this webinar 
 

Call-for-Participation: Moisture Induced Expansion Metrology for Packaging Polymetric Materials, Session 2

Date(s): January 18, 2022

Time: 8:00 AM  EST - 9:00 AM  EST

Session 2 (Americas/Europe/APAC) 
Tuesday, January 18 
8:00-9:00 a.m. EST (Americas) 
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan) 
Register for this webinar 


Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.  

Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. However, hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).  

Phase 1 of the Moisture Induced Expansion Metrology for Packaging Polymetric Materials project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits.  Join iNEMI for this call-for-participation webinar to learn more about this new project.


Session 1 (APAC/Americas)
Tuesday, January 18
10:00-11:00 a.m. JST (Japan)
8:00-9:00 p.m. EST (Americas) on Monday, January 17 
Register for this webinar 
 




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