Event Calendar

Friday, January 21, 2022

Call for Participation: Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4 — Session 2

Date(s): January 21, 2022

Time: 10:00 AM  EST - 10:00 AM  EST

Session 2 (APAC/Americas)
Friday, January 21
10:00-11:00 a.m. JST (Japan) 
5:00-6:00 p.m. PST (Americas) on Thursday, January 20
Register for this webinar

Heterogeneous SiP packages are increasingly being used as an electronic packaging solution and these packages require finer circuitry patterns designed within the substrate/interposer (lines and spaces <10um). These fine pitch substrates/interposers plus larger panel sizes and more layers on substrates demand increased AOI capability to accurately detect, characterize and reject the true defects without over-rejections. Finer trace width and spaces will need better AOI optics to reduce the field of view and depth of focus while addressing warpage issues and organic panel shrinkage. 

iNEMI’s new Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4  will study defect detection plus line width and space measurement for circuit patterns below 5um line space. This project will provide a better understanding of current AOI measurement and inspection systems and the latest technology trends for AOI solutions. The ultimate goal of this project is to drive the readiness of innovative AOI inspection systems to reduce the defect escape risk for finer pattern substrate and interposers. 

Session 1 (Americas/Europe/APAC) 
Thursday, January 20 
8:00-9:00 a.m. EST (Americas) 
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan) 
Register for this webinar

iNEMI Presentation at EMA 2022

Date(s): January 21, 2022

Time: 8:30 AM  EST - 12:30 PM  EST

iNEMI Presentation at EMA 2022
Hybrid Electronic Materials and Applications (EMA) 2022 
Session 12: 5G Materials and Applications Telecommunications
Metrology and Characterization of Materials

January 21, 2022 / 8:30 a.m. — 5:00 p.m.
Location: Citrus B

Measurements 8:30 a.m. — 12:30 p.m.

10:30 a.m.   "Innovative Approaches to Solve Low Loss Materials
                     Characterization Challenges"
                     Urmi Ray (iNEMI) 

The Hybrid Electronic Materials and Applications (EMA) conference is hosted by the American Ceramics Society. Be sure to check out Session 12 if you plan to participate in EMA this year. 


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