Primary Factors in Component Warpage

Chair: Peng
Su, Cisco

Problem Statement

• No clear understanding of the key contributors to the 1st and 2nd level assembly

Objectives

• Identify key material properties (core, core/SM thickness, substrate, design (Cu trace/via), package assembly) and key contributors (die size, thickness) which impacts 1st level and 2nd level for different applications
• Identify key process parameters (UF, MC, etc.), reflow profile, package pitch, PCB, environmental factors (shipping and storage; moisture effect) which impact warpage
• Establish understanding to modulate the key contributors

Expected Output

• A set of primary parameters (materials, design and processes) and the working window to control the warpage through supply chain
• Recommendation / guidelines for shipping and storage

Statement of Work

• Statement of Work - Primary Factors in Component Warpage (Version 3.0, September 21, 2010) (initial sign up ended November 8, 2010)

Related Work

• Package Warpage Qualification Criteria (Phase 1)
• Warpage Characteristics of Organic Packages, Phase 2
• Warpage Characteristics of Organic Packages, Phase 3

For Additional Information

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