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Project Portfolio (September 2022)

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We have a lot going on! iNEMI is an industry-led consortium of manufacturers, suppliers, industry associations and consortia, government agencies, research institutes, and universities, and through the combined power of this global membership, we help drive technology development and deployment across the global supply chain. One of the ways we do that is through our project work — how projects are formed.

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5G/mmWave

• 5G/mmWave Materials Assessment and Characterization

Board Assembly

• Connector Reliability Test Recommendations
• Connector Reliability Test Recommendations, Phase 2
• Conformal Coating Evaluation for Improved Environmental Protection, Phase 1 
• Conformal Coating Evaluation for Improved Environmental Protection, Phase 2
• Creep Corrosion: Investigation of Factors that Influence Creep Corrosion
• Creep Corrosion: Qualification Test Development
  • ​Qualification Test Development for Creep Corrosion, Phase 1 
  • Qualification Test Development for Creep Corrosion, Phase 2: Flowers of Sulfur Chamber
  • Qualification Test Development for Creep Corrosion, Phase 3: The Effect of Relative Humidity on Creep Corrosion
• Counterfeit Components - Assessment Methodology and Metric Development
• High Density Interconnect Socket Warpage Prediction and Characterization, Phase 1
• PCBA Cleanliness, Phase 1
• PCB Warpage Characterization and Minimization
• Ultra Low Loss Laminate/PCB For High Reliability and Performance

 

Optoelectronics

• Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 1
• Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 2
• Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 3
• iNEMI-IPSR Board-Level Optical Interconnect Project
• iNEMI-IPSR Board-Level Optical Interconnect, Phase 2
• Module with Separable Single-Mode Expanded-Beam Optical Interface for Edge-Coupled PIC Optics

 

Packaging

• 1st Level Interconnect Void Characterization, Phases 1 & 2
• ​Fine Pitch Circuit Pattern Inspection/Metrology, Phase 1
• High-Temperature, Pb-free Die-Attach Material
• Low Temperature Material for 1st Level Interconnect Task Force
• New Packaging Technology Qualification Methodology
• Package Warpage Prediction and Characterization, Phase 5
• SiP Module Moldability
• Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
• Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3
• Wafer/Panel Level Package Flowability and Warpage
• Warpage Characteristics of Organic Packages, Phase 3
• Warpage Characteristics of Organic Packages, Phase 4

Smart Manufacturing

• Back End Commonality for Advanced Packaging Large Form Factor
• Smart Manufacturing: Data Management Best Practices for PCB Assembly

 

PCB & Laminates

• Improving UL Certification of Laminates and PCBs
• PCB/PCBA Material Characterization for Automotive Harsh Environments
• Ultra Low Loss Laminate/PCB For High Reliability and Performance
   

Sustainable Electronics

• Eco-Impact Estimator, Phase 3
• Eco-Impact Evaluator for ICT Equipment, Phase 1
• Eco-Impact Evaluator for ICT Equipment, Phase 2
• Eco-Design for Circular Electronics Economy
• Extended Reliability Assessment for Electronic Components
• Metals Recycling
• Repair and Recycling Metrics, Phase 1
• Reuse and Recycling Metrics, Phase 2
• Value Recovery from Used Electronics, Phase 1
• Value Recovery from Used Electronics, Phase 2