Completed Projects

Board Assembly

• Connector Reliability Test Recommendations
• Connector Reliability Test Recommendations, Phase 2
• Conformal Coating Evaluation for Improved Environmental Protection, Phase 1  
• Qualification Test Development for Creep Corrosion, Phase 3
• Package Warpage Prediction and Characterization
• PCBA Cleanliness, Phase 1
• PCB Warpage Characterization and Minimization
• Ultra Low Loss Laminate/PCB For High Reliability and Performance

 

Optoelectronics

• Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 1
• Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 2
• Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 3
• iNEMI-IPSR Board-Level Optical Interconnect Project
• iNEMI-IPSR Board-Level Optical Interconnect, Phase 2

 

Packaging

• Fine Pitch Circuit Pattern Inspection/Metrology, Phase 1
• High-Temperature, Pb-free Die-Attach Material
• New Packaging Technology Qualification Methodology
• SiP Module Moldability
• Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
• Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3
• Wafer/Panel Level Package Flowability and Warpage
• Warpage Characteristics of Organic Packages, Phase 3
• Warpage Characteristics of Organic Packages, Phase 4

PCB & Laminates

• Improving UL Certification of Laminates and PCBs

 

Sustainable Electronics

• Eco-Impact Estimator, Phase 3
• Reuse and Recycling Metrics, Phase 2
• Value Recovery from Used Electronics, Phase 1
• Value Recovery from Used Electronics, Phase 2 
• Eco-Impact Evaluator for ICT Equipment, Phase 1
• Eco-Impact Evaluator for ICT Equipment, Phase 2
• Metals Recycling
• Repair and Recycling Metrics, Phase 1