Completed
Project Portfolio (June 2022)
Board Assembly
- Connector Reliability Test Recommendations
- Connector Reliability Test Recommendations, Phase 2
- Conformal Coating Evaluation for Improved Environmental Protection, Phase 1
- Qualification Test Development for Creep Corrosion, Phase 3
- PCBA Cleanliness, Phase 1
- PCB Warpage Characterization and Minimization
- Ultra Low Loss Laminate/PCB For High Reliability and Performance
Optoelectronics
- Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 1
- Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 2
- Development of Cleanliness Specification for Expanded Beam Connectors Project, Phase 3
- iNEMI-IPSR Board-Level Optical Interconnect Project
- iNEMI-IPSR Board-Level Optical Interconnect, Phase 2
Packaging
- Fine Pitch Circuit Pattern Inspection/Metrology, Phase 1
- High-Temperature, Pb-free Die-Attach Material
- New Packaging Technology Qualification Methodology
- Package Warpage Prediction and Characterization
- SiP Module Moldability
- Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 2
- Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology, Phase 3
- Wafer/Panel Level Package Flowability and Warpage
- Warpage Characteristics of Organic Packages, Phase 3
- Warpage Characteristics of Organic Packages, Phase 4
Smart Manufacturing
- Back End Commonality for Advanced Packaging Large Form Factor
- Smart Manufacturing: Data Management Best Practices for PCB Assembly
PCB & Laminates
Sustainable Electronics
- Eco-Impact Estimator, Phase 3
- Reuse and Recycling Metrics, Phase 2
- Value Recovery from Used Electronics, Phase 1
- Value Recovery from Used Electronics, Phase 2
- Eco-Impact Evaluator for ICT Equipment, Phase 1
- Eco-Impact Evaluator for ICT Equipment, Phase 2
- Metals Recycling
- Repair and Recycling Metrics, Phase 1