Ranjan Chatterjee, Cimetrix
Dan Gamota, Jabil
iNEMI’s Smart Manufacturing: Data Management Best Practices for PCB Assembly End-of-Project Webinar (October 7, 2021)
SOW & Project Statement
For electronic assembly manufacturers, digitizing the factory floor by implementing machine-to-machine (M2M) as well as machine-to-host communications and closed-loop feedback is a key enabler to improving assembly line efficiency and yield. Today, equipment suppliers offer M2M communication solutions using their own equipment, software and proprietary algorithms. However, these supplier-specific solutions cannot be replicated or scaled in a manufacturing environment where diverse supplier equipment as well as legacy equipment are used. The electronic assembly supply chain is going through a rapid consolidation between semiconductor fabrication, OSAT and PCBA industries that requires a generic, scalable solution that enables implementation of smart PCB assembly into an existing, diverse manufacturing footprint, avoiding investment in new equipment and technology.
The purpose of this project is to develop a generic reference data flow architecture and best practices for a typical electronics assembly line that can be shared with industry to enable efficient implementation of smart PCB assembly in a manufacturing environment where diverse supplier equipment is used. There will be three distinct phases:
- Phase 1: Develop the reference architecture and best practices, based on at least one use case that represents one key electronic assembly process step
- Phase 2: Physical implementation of the use case using production equipment to validate best practices and demonstrate the ability to collect, analyze and act on data, in real time
- Phase 3: Expand scope to a full PCBA line and demonstrate measurable assembly line performance improvement in terms of yield, output, uptime etc.