Ian Chin, Intel
Wei Keat Loh, Intel
Presentation & recording from the call-for-participation webinar (January 17 & 18, 2022)
Statement of Work and Project Statement
Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.
Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. Hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).
This project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits.
The ultimate goal of this iNEMI project is to give materials companies a better understanding of quantifiable material properties at higher temperatures and moisture concentrations to enable them to develop innovative new materials that minimize the risk of failure due to moisture and humidity.
“Extending the High Temperature Hygroscopic Swelling Characterization Limits,” Ian Chin, Intel, Session WA1-2: iNEMI Session, May 11, 2022, 2022 International Conference on Electronics Packaging (ICEP 2022)
Steps for Joining the Project
Please note: iNEMI membership is required to participate in this project.
For iNEMI members:
Complete and sign the project statement and email to email@example.com