Moisture Induced Expansion Metrology for Packaging Polymetric Materials Project, Phase 1

Project Leaders


Ian Chin, Intel


Wei Keat Loh, Intel

 

Call-for-Participation Webinar

Presentation & recording from the call-for-participation webinar (January 17 & 18, 2022)

Statement of Work and Project Statement ‚Äč


Background

Electronic packaging is made up of polymeric materials (dielectric, solder resist, core, mold, epoxy, etc.) that absorb moisture from the environment during substrate fabrication, packaging assembly and test processing. Absorbed moisture can cause material hygroscopic swelling and induces hygro-stress, which can lead to component warpage, delamination or popcorn failure during reflow or reliability tests.  

Knowledge of the moisture properties of polymeric materials (diffusivity, concentration, hygroscopic swelling) is critical for optimizing package material and design to minimize moisture-related failures. Hygro-swelling properties are not widely available due to a lack of measurement methods, and existing commercial measurement techniques have limited temperature capability (20-120°C).  

 

Project Focus

This project will provide an experiment-based assessment of metrology options for characterization of materials expansion measurement and recommend a new metrology for moisture-induced CTE that extends swelling strain measurement capabilities beyond current temperature limits. 

The ultimate goal of this iNEMI project is to give materials companies a better understanding of quantifiable material properties at higher temperatures and moisture concentrations to enable them to develop innovative new materials that minimize the risk of failure due to moisture and humidity.
 

Steps for Joining the Project

Please note: iNEMI membership is required to participate in this project.  

For iNEMI members:
Complete and sign the project statement and email to infohelp@inemi.org

For non-members:

Contact

For additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org).