BiSn-Based Low-Temperature Soldering Process and Reliability
Project Leader
![]() Raiyo Aspandiar, Intel
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Statement of Work and Project Statement
BackgroundLatest update ObjectiveThe purpose of this project is to assess the surface mount processibility and reliability of the solder joints formed when enhanced BiSn-based solder pastes are used for assembling electronic components on printed circuit boards. PresentationsiNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes - Part VII: Mechanical Shock Test and Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components, Presentation #462: Lead-Free & Low Temp Soldering Technologies (LF) Track, presented by Jagadeesh Radhakrishnan (Intel), SMTA International 2020. (Currenty available to members only; requires log-in.) paper presentationiNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part VI: Post Mechanical Shock Failure Analysis on Mixed SnAgCu-BiSn Solder Joints of FCBGA Components, presented by Raiyo Aspandiar (Intel Corporation), SMTA International, September 26, 2019; Rosemont, Illinois. iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes Part IV: Comprehensive Mechanical Shock Tests on POP Components Having Mixed BGA BiSn-SAC Solder Joints; presented by Raiyo Aspandiar (Intel), SMTA International, October 18, 2018 (Rosemont, Illinois) Presentation and Paper: iNEMI Project on Process Development of BiSn-Based Low Temperature Solder Pastes — Part III: mechanical shock tests on PoP BGA assemblies, Jagadeesh Radhakrishna (Intel), presented at ICEP-IAAC 2018 (April 19, 2018; Kuwana, Mie, Japan) (iNEMI members only) iNEMI Project on Process Development of BiSn-Based Low-Temperature Solder Pastes - Part II: Characterization of Mixed Alloy BGA Solder Joints; Raiyo Aspandiar (Intel); Pan Pacific Microelectronics Symposium (February 6, 2018; Big Island, Hawaii) iNEMI Project on Process Development of BiSn-Based Low-Temperature Solder Pastes; Raiyo Aspandiar (Intel); SMTAI (September 20, 2017; Rosemont, Illinois, USA) Related Information
Haley Fu |