iNEMI Presentations at SMTAI 2016

A Collaborative Industrial Consortia Program to Characterize the Thermal Fatigue Reliability of Third-generation Pb-Free Alloys (Paper will be posted when it becomes available.)
Richard Coyle, Ph.D., and Joe Smetana, Nokia; Richard Parker, iNEMI; Keith Howell and Keith Sweatman, Nihon Superior Co., Ltd.; Weiping Liu, Indium Corp.; Julie Silk, Keysight Technologies; Stuart Longgood, Delphi; Michael Osterman, Ph.D., CALCE; Rafael Padilla, P.E., B.A., and Tomoyasu Yoshikawa, Senju Metal Industry Co.; Mitch Holtzer, Alpha; Jasbir Bath, Bath & Associates Consultancy; David Hillman, Rockwell Collins; Eric Lundeen, i3 Electronics; Superior Co., Ltd.; Andre Kleyner, Delphi; Jerome Noiray, Sagem; Polina Snugovsky, Ph.D., Celestica Inc. 

iNEMI Connector Reliability Test Recommendations Project Report Shane Kirkbride, Keysight Technologies; Vincent C. Pascucci, TE Connectivity; Michael Wollitzer and Christian Dandl, Rosenberger; Philip Conde, Dell; Bob Martinson, Lotestech; Ife Hsu and Vasu S. Vasudevan, Intel Corporation    

2017 iNEMI Roadmap Preview of Selected IoT, Board Assembly & Optoelectronics Chapter Highlights, Chuck Richardson, iNEMI