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  • Registration — Board Assembly Tech Topic Series: Mechanical Shock Drop Reliability of BiSn Low-Temperature Solders
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  • Technology Integration Groups (TIGs)
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Upcoming Events

  • 5
    Apr
    Sustainable Electronics TIG: New Circular Economy Standards (members only)

    11:00 AM to 12:00 PM EDT

  • 13
    Apr
    Call for Participation: Low-Temp Material Characterization for 1st Level Interconnect - Session 2

    9:00 AM to 10:00 AM EDT

  • 13
    Apr
    Call for Participation: Low-Temp Material Characterization for 1st Level Interconnect - Session 1

    10:00 AM to 11:00 AM JST

  • 19
    Apr
    iNEMI Session at ICEP 2023

    9:30 AM to 11:15 AM JST

  • 19
    Apr
    Eco-Impact Estimator Planning Meetings

    11:00 AM to 12:00 PM EDT

View All Events

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