Papers & Presentations

5G/mmWave

2021 iNEMI Tech Topic Series: 5G/mmWave


Webinar/Conference Presentations & Reports
  • Microwave & Radar Week (MRW) 2022 (September 12-17; Gdansk, Poland)
    These presentations are available to iNEMI members only; log-in required to download. 
    • iNEMI Workshop on Microwave and Millimetre-Wave Characterization of Dielectric Sheets: presentations by Dr. Marzena Olszewska-Placha (QWED, Bartlomiej Salski (Warsaw University of Technology) and Michael Hill, PhD (Intel)
    •  Conference Keynote: “Correlating mmWave Permittivity Measurement Tools with an Introduction to Intel’s Metrology Capability Analysis,” Michael Hill, PhD (Intel)
  • “Modelling Insights into the Recent Assessment of Materials for 5G Applications,” Dr. Marzena Olszewska-Placha (QWED), 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), July 6-8; Limoges, France
  • Industry Workshop / Session IWTH3: Materials Characterization and Assessment for 5G-mmWave Applications, IEEE’s International Microwave Symposium (IMS), June 22, 2022, Denver, Colorado USA
    • “Review of 5G Industry Needs in Terms of Materials Characterization,” Say Phommakesone (Keysight Technologies)
    • “EM Performance” (illustrated with full-wave electromagnetic simulations), Malgorzata Celuch (QWED)
    • “Review of the iNEMI Round-Robin Materials Characterization Results,” Marzena Olszweska-Placha (QWED) and Lucas Enright (NIST)
    • “Best Practices and Recommendations for Development of Standard Reference Materials,” Nate Orloff (NIST) and Urmi Ray (iNEMI)
  • “Materials Characterization and Assessment for 5G/mmWave Applications,” presented by Malgorzata Celuch (QWED) and Say Phommakesone (Keysight Technologies), Microapps Seminar TUMA28, IEEE’s International Microwave Symposium (IMS), June 21, 2022, Denver, Colorado, USA. 
  • 5G/mmWave Materials Assessment & Characterization End-of-Project Webinar (June 2, 2022)
  • mmWave Permittivity Reference Material Development Project Call-for-Participation Webinar (May 5, 2022)
  • iNEMI 5G/mmWave Presentations at Device Packaging Conference (March 8; Fountain Hills, Arizona USA)   (Please note: we do not have permission to post these presentations; please check with iMAPS for conference proceedings.)
    • Industry Challenges for Low Loss Measurements, Urmi Ray (iNEMI) and Say Phommakesone  (Keysight)
    • Key Highlights from iNEMI 5G Project, Michael Hill (Intel)
    • 5G Electronics: Bridging the Measurement Challenges, Magorzata Celuch and Marzena Olszewska-Placha (QWED)
    • mmWave Reference Material Development at NIST, Nathan Orloff (NIST)
  • 5G/mmWave Materials Assessment and Characterization Project, Report 3: A Round Robin Study to Determine Measurement Accuracies of Commercial Resonator-Based Techniques (January 2022; members only) 
  • "Innovative Approaches to Solve Low Loss Materials Characterization Challenges," invited presentation, Urmi Ray (iNEMI), Electronic Materials and Applications 2022, Session S13: 5G Materials and Applications Telecommunications — Metrology and Characterization of Materials, January 22, 2022, virtual event).
  • Importance of Materials Characterization for 5G and Beyond,” Say Phommakesone (Keysight Technologies), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan) 
  • 5G/mmWave Material Characterization” Chang-Sheng Chen (ITRI), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan)
  • “Measuring Complex Permittivity for 5G/mmWave Materials,” Hanna Kähäri (Nokia), Session 3.1: Equipment and Materials for Enabling High Performance, Connecting Heterogeneous Systems Summit, September 1, 2021 (virtual event) 
  • “Solving High Frequency Materials Characterization Challenges in 5G Electronics,” Urmi Ray (iNEMI), webinar sponsored by the International Wireless Industry Consortium (IWIC), June 16, 2021 
  • “5G/High Frequency Materials Test Challenges: Closing the Gaps via E2E Supply Chain Collaborative Innovation,” Urmi Ray (iNEMI), NIST Workshop: Securing the 5G Supply Chain through Measurement, Potential Adoption Paths for Measurements in 5G Hardware Security Session, May 19, 2021
  • High Frequency Measurements Using Wafer Level TechniquesMeasuring Low dK/dFMaterials from 1 GHz to 1 THz,” presented by Nathan Orloff (NIST), iNEMI session at ICEP, May 13, 2021 (virtual event)
  • 5G Electronics Challenges: High Frequency Materials Characterization, iNEMI Invited Session at the International Conference on Device Packaging, April 14, 2021 (virtual event), International Microelectronics Assembly and Packaging Society (iMAPS)
    Session Chair: Urmi Ray (iNEMI)
    Presentations and speakers:
    • Challenges for High Dk/Df Measurements,” Urmi Ray (iNEMI)
    • Benchmarking Resonator based Low Dk/Df Material Measurements,” Richard Stephenson (EMD Electronics)
    • Recent Developments of Resonator Measurements for Emerging Materials and Technologies,” Magorzata Celuch & Marzena Olszewska-Placha (QWED)
    • High Frequency Measurements Using Wafer Level Techniques,” Nathan Orloff (NIST)
    • Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements,” Say Phommakesone and Daisuke Kato (Keysight Technologies)
  • iNEMI Technical Session: 5G/High Frequency Materials Characterization Challenges and Opportunities, IPC APEX EXPO, March 12, 2021, moderated by Urmi Ray (iNEMI) March 12, 2021
    • "High Frequency Measurements using Wafer Level Techniques," Nathan Orloff (NIST)
    • "Benchmarking Resonator Based Low Dk/Df Material Measurements," Michael Hill (Intel) and Malgorzata Celuch (QWED). 
    • "Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements," Say Phommakesone and Daisuke Kato (Keysight)
  • 5G/High Frequency Materials Characterization Challenges and Opportunities,” Urmi Ray (iNEMI), Electronic Materials and Applications (EMA) Conference, American Ceramic Association (January 22, 2021; virtual event).
  • 5G/mmWave Materials Assessment and Characterization Project, Report 1: Benchmark Current Industry Best Practices for Low Loss Measurements (November 2020; members only)  
  • 5G/mmWave Materials Assessment and Characterization Project, Report 2: Benchmark Emerging Industry Best Practices for Low Loss Measurements (November 2020; members only)  

Board Assembly 

2021 iNEMI Tech Topic Series: Board Assembly


Webinar & Conference Presentations  

Miscellaneous

Optoelectronics

 

Packaging

Packaging Technology Integration Group (TIG)
2022 iNEMI Tech Topic Series: Advanced Packaging
(these presentations are available to members only, unless otherwise noted)

2021 iNEMI Tech Topic Series: Advanced Packaging
(these presentations are available to members only, unless otherwise noted)
Webinar & Conference Presentations  

PCB & Laminates

 

Roadmap

 

Smart Manufacturing

2022 iNEMI Tech Topic Series: Smart Manufacturing Webinar & Conference Presentations  

Sustainable Electronics

Tech Topic Series: Eco-Design for Circular Electronics Economy
  • Eco-Design Tech Topic Series: Lessons Learned, Julio Vargas, IBM,  March 17, 2022 
  • Session #6 — Jan Daem (Barco), November 4, 2021
  • Session #5 — Nirav Patel (Framework) (October 14, 2021)
  • Eco-Design for Circular Electronics Economy Series Report, October 12 & 13, 2021
  • Session #4 — David Schönmayr (Fronius) and Maxwell Giammona (IBM Almaden Research Center), September 9, 2021
  • Session #3 — Klaus Grobe (ADVA Optical) and Katie Morgenroth & Adi Narayanan (Google), July 27, 2021     
  • Session #2 — Christophe Garnier (Schneider Electric) and Miquel Ballester & Thea Kleinmagd (Fairphone), June 17, 2021      
  • Session #1 — Pia Tanskanen (Nokia) and Mark Newton (Samsung North America), May 25, 2021      
Webinar, Conference Presentations & Reports