Papers & Presentations

5G/mmWave

2021 iNEMI Tech Topic Series: 5G/mmWave

• “Enabling Thin Glass Solutions for 5G,” Aric Shorey (Mosaic Microsystems), July 15, 2021
• “Standard Reference Materials for 5G and Microwave Materials at NIST,” Dr. Nathan Orloff (NIST), May 6, 2021
• “Broad Dielectric Characterization of Polymers and Ceramics in the 5G Frequency Range,” Professor Michael Lanagan (Penn State), April 8, 2021
• “Packaging for mmWave Communications,” Professor Madhavan Swaminathan (Georgia Institute of Technology), March 11, 2021

Webinar/Conference Presentations & Reports

• Microwave & Radar Week (MRW) 2022 (September 12-17; Gdansk, Poland)
  These presentations are available to iNEMI members only; log-in required to download. 
  • iNEMI Workshop on Microwave and Millimetre-Wave Characterization of Dielectric Sheets: presentations by Dr. Marzena Olszewska-Placha (QWED, Bartlomiej Salski (Warsaw University of Technology) and Michael Hill, PhD (Intel)
  •  Conference Keynote: “Correlating mmWave Permittivity Measurement Tools with an Introduction to Intel’s Metrology Capability Analysis,” Michael Hill, PhD (Intel)
• “Modelling Insights into the Recent Assessment of Materials for 5G Applications,” Dr. Marzena Olszewska-Placha (QWED), 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), July 6-8; Limoges, France
• Industry Workshop / Session IWTH3: Materials Characterization and Assessment for 5G-mmWave Applications, IEEE’s International Microwave Symposium (IMS), June 22, 2022, Denver, Colorado USA
  • “Review of 5G Industry Needs in Terms of Materials Characterization,” Say Phommakesone (Keysight Technologies)
  • “EM Performance” (illustrated with full-wave electromagnetic simulations), Malgorzata Celuch (QWED)
  • “Review of the iNEMI Round-Robin Materials Characterization Results,” Marzena Olszweska-Placha (QWED) and Lucas Enright (NIST)
  • “Best Practices and Recommendations for Development of Standard Reference Materials,” Nate Orloff (NIST) and Urmi Ray (iNEMI)
• “Materials Characterization and Assessment for 5G/mmWave Applications,” presented by Malgorzata Celuch (QWED) and Say Phommakesone (Keysight Technologies), Microapps Seminar TUMA28, IEEE’s International Microwave Symposium (IMS), June 21, 2022, Denver, Colorado, USA. 
• 5G/mmWave Materials Assessment & Characterization End-of-Project Webinar (June 2, 2022)
• mmWave Permittivity Reference Material Development Project Call-for-Participation Webinar (May 5, 2022)
• iNEMI 5G/mmWave Presentations at Device Packaging Conference (March 8; Fountain Hills, Arizona USA)   (Please note: we do not have permission to post these presentations; please check with iMAPS for conference proceedings.)
  • Industry Challenges for Low Loss Measurements, Urmi Ray (iNEMI) and Say Phommakesone  (Keysight)
  • Key Highlights from iNEMI 5G Project, Michael Hill (Intel)
  • 5G Electronics: Bridging the Measurement Challenges, Magorzata Celuch and Marzena Olszewska-Placha (QWED)
  • mmWave Reference Material Development at NIST, Nathan Orloff (NIST)
• 5G/mmWave Materials Assessment and Characterization Project, Report 3: A Round Robin Study to Determine Measurement Accuracies of Commercial Resonator-Based Techniques (January 2022; members only) 
• "Innovative Approaches to Solve Low Loss Materials Characterization Challenges," invited presentation, Urmi Ray (iNEMI), Electronic Materials and Applications 2022, Session S13: 5G Materials and Applications Telecommunications — Metrology and Characterization of Materials, January 22, 2022, virtual event).
• “Importance of Materials Characterization for 5G and Beyond,” Say Phommakesone (Keysight Technologies), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan) 
• “5G/mmWave Material Characterization” Chang-Sheng Chen (ITRI), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan)
• “Measuring Complex Permittivity for 5G/mmWave Materials,” Hanna Kähäri (Nokia), Session 3.1: Equipment and Materials for Enabling High Performance, Connecting Heterogeneous Systems Summit, September 1, 2021 (virtual event) 
• “Solving High Frequency Materials Characterization Challenges in 5G Electronics,” Urmi Ray (iNEMI), webinar sponsored by the International Wireless Industry Consortium (IWIC), June 16, 2021 
• “5G/High Frequency Materials Test Challenges: Closing the Gaps via E2E Supply Chain Collaborative Innovation,” Urmi Ray (iNEMI), NIST Workshop: Securing the 5G Supply Chain through Measurement, Potential Adoption Paths for Measurements in 5G Hardware Security Session, May 19, 2021
• “High Frequency Measurements Using Wafer Level Techniques: Measuring Low dK/dFMaterials from 1 GHz to 1 THz,” presented by Nathan Orloff (NIST), iNEMI session at ICEP, May 13, 2021 (virtual event)
• 5G Electronics Challenges: High Frequency Materials Characterization, iNEMI Invited Session at the International Conference on Device Packaging, April 14, 2021 (virtual event), International Microelectronics Assembly and Packaging Society (iMAPS)
  Session Chair: Urmi Ray (iNEMI)
  Presentations and speakers:
  • “Challenges for High Dk/Df Measurements,” Urmi Ray (iNEMI)
  • “Benchmarking Resonator based Low Dk/Df Material Measurements,” Richard Stephenson (EMD Electronics)
  • “Recent Developments of Resonator Measurements for Emerging Materials and Technologies,” Magorzata Celuch & Marzena Olszewska-Placha (QWED)
  • “High Frequency Measurements Using Wafer Level Techniques,” Nathan Orloff (NIST)
  • “Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements,” Say Phommakesone and Daisuke Kato (Keysight Technologies)
• iNEMI Technical Session: 5G/High Frequency Materials Characterization Challenges and Opportunities, IPC APEX EXPO, March 12, 2021, moderated by Urmi Ray (iNEMI) March 12, 2021
  • "High Frequency Measurements using Wafer Level Techniques," Nathan Orloff (NIST)
  • "Benchmarking Resonator Based Low Dk/Df Material Measurements," Michael Hill (Intel) and Malgorzata Celuch (QWED). 
  • "Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements," Say Phommakesone and Daisuke Kato (Keysight)
• “5G/High Frequency Materials Characterization Challenges and Opportunities,” Urmi Ray (iNEMI), Electronic Materials and Applications (EMA) Conference, American Ceramic Association (January 22, 2021; virtual event).
• 5G/mmWave Materials Assessment and Characterization Project, Report 1: Benchmark Current Industry Best Practices for Low Loss Measurements (November 2020; members only)  
• 5G/mmWave Materials Assessment and Characterization Project, Report 2: Benchmark Emerging Industry Best Practices for Low Loss Measurements (November 2020; members only)  

Board Assembly 

2021 iNEMI Tech Topic Series: Board Assembly

• “Mechanical Shock Performance of LTS,” Raiyo Aspandiar and Jagadeesh Radhakrishnan (Intel), September 21 & October 12, 2021 (members only)
• “Surface Finish Selection for Advanced PCB and Chip Substrates,” John Swanson (MacDermid Alpha Circuitry Solutions), July 22, 2021)
• “PCB Cleaning,” Stefan Strixner (ZESTRON), July 8, 2021
• “Causes and Cures of Delamination, Cracks and Blisters in Conformal Coating Layers,” Freddy Gilbert (ZESTRON), June 30, 2021

Webinar & Conference Presentations

• High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2 Call-for-Participation Webinar (January 4/5, 2023)  
• "High Density Interconnect Socket Warpage Prediction and Characterization," Renn Chan Ooi (Intel Corp, Malaysia), Electronics Packaging Technology Conference (EPTC), December 9, 2022; Singapore) (members only; requires log-in)  paper  presentation  poster
• iNEMI Survey Report: AI Enhancement to AOI for PCB Assembly (October 25, 2022)
• End-of-Project Webinar: Conformal Coating Evaluation for Improved Environmental Protection, Phase 2  (May 25 & June 9, 2022)
• “Comparing Various Test Environments for Conformal Coating Evaluation,” Prabjit Singh, IBM, Session TD2-3: Emerging Technology 3, May 12, 2022, 2022 International Conference on Electronics Packaging (ICEP 2022)     paper        presentation
• Electromigration of SnBi Solder for Second-Level Interconnect Project Call for Participation (January 11 & 13, 2022) 
• End-of-Project Webinar: Package Warpage Prediction and Characterization Project, December 14 & 15, 2021 
• “Mechanical Shock Testing and Failure Analysis on Mixed SnAgCu-BiSn and Full Stack BiSn Solder Joints of CABGA192 Components,” Raiyo Aspandiar, Ph.D., and Jagadeesh Radhakrishnan (Intel Corporation), Session LTS2: Reliability Testing, SMTA International, November 2, 2021 (Minneapolis, Minnesota)   
  paper      presentation 
• “Interim Thermal Cycling Report on Hybrid and Homogeneous LTS Solder Joints,” Richard Coyle, Ph.D. (Nokia Bell Labs), Session LTS2: Reliability Testing, SMTA International, November 2, 2021 (Minneapolis, Minnesota)    paper      presentation  
• Call-for-Participation: Investigation of AI Enhancement to AOI for PCBA Project, October 13 & 14, 2021 
• “Development of a Quick Test for Conformal Coatings,” PJ Singh (IBM), presented by Chen Xu, (Nokia), Session TU3B, EMPC, September 13-16, 2021 (virtual event)    paper      presentation
• “Post Mechanical Shock Test Failure Analysis on Mixed SnAgCu-BiSn BGA Solder Joints,” Raiyo Aspandiar (Intel), On-Demand Session OD-49, ICEP 2021 (virtual event)
• "Predictive Modelling Methodologies for Bi-Material Wafer Warpage," presented by Jennan Wang (CoreTech System/Moldex3D), iNEMI session at ICEP (virtual event), May 13, 2021     
• Call-for-Participation: Conformal Coating Evaluation for Improved Environmental Protection, Phase 2, April 6/7 & 13, 2021
• "Conformal Coating Evaluation Test Development," Prabjit Singh (IBM Corporation), Electronics Assembly Materials and Coatings Session, IPC APEX EXPO, March 11, 2021
• End-of-Project Webinar: Conformal Coating Evaluation for Improved Environmental Protection, January 5, 2021 

 

Miscellaneous

• iNEMI Presentations from SMTA International (October 31-November 3; Minneapolis, Minnesota) 
• Presentations from iNEMI Workshop on Reliability Challenges & Solutions for Automotive Electronics (October 30; Shanghai; members only)
• iNEMI Council of Members Meeting, June 20 & 21, 2022 (members only)
• “A Roadmap of Value Delivery to the Electronics Manufacturing Value Chain,” Shekhar Chandrashekhar, US ISES (May 9, 2022; Scottsdale, Arizona) 
• iNEMI Council of Members Meeting, June 14 & 15, 2021 (members only) 
• “Keeping Electronics Reliable When Disinfecting Factories for COVID-19,” Julie Silk (Keysight Technologies), Industry Session: Reliability Is EVERYONE’S Responsibility, Applied Power Electronics Conference (APEC) (June 9-12; virtual event)
   

Optoelectronics

• “Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits,” IEEE/OSA Journal of Lightwave Technology, 24 January 2023, pp 1-9. 
• Best Practices for Expanded Beam Connectors in Data Centers End-of-Project Webinar (November 10 & 11, 2022)
• “Development of Best Practices and Guidelines for the Use of Expanded Beam Connectors in Data Center Applications,” presented by Tatiana Berdinskikh (Senko Advanced Components), on behalf of iNEMI’s Best Practices for Expanded Beam Connectors in Data Centers project team, IWCS Cable & Connectivity Industry Forum, Session 3: Advances in Optical Connectivity, October 12, 2022 (Providence, Rhode Island). NOTE: this paper was voted best paper in the Optical Connectivity session.
• “Demonstration of a Single-Mode Expanded-Beam Connectorized Module for Photonic Integrated Circuits,” Kamil Gradkowski, Tyndall National Institute, European Conference on Optical Communication (ECOC) 2022 (September 22, 2022; Basel, Switzerland)
• End-of-Project Webinar, Session 2: Module with Separable Single-Mode Expanded-Beam Optical Interface for Edge-Coupled PIC Optics Project, (August 31 & September 29, 2022)
• ​Call-for-Participation: Module with Separable Single-Mode Expanded-Beam Optical Interface for Edge-Coupled PIC Optics, April 14, 2021   

 

Packaging

Packaging Technology Integration Group (TIG)

• iNEMI Packaging TIG Meeting, August 25, 2022 (members only)
  • Packaging TIG Presentation
  • Advanced Packaging Challenges, E. Jan Vardaman, TechSearch International

2022 iNEMI Tech Topic Series: Advanced Packaging
(these presentations are available to members only, unless otherwise noted)

• Packaging Tech Topic Series: Advances in Interconnect and Assembly Technologies for Next Generation Electronic Systems, Chris Scanlan, Besi (December 13)
• Packaging Tech Topic Series: “Application-Specific Qualification for Electronics,” David Locker, Jr., U.S. Army Aviation and Missile Center, May 17, 2022 (members only — requires log-in). 
• Packaging Tech Topic Webinar: “Quantum Computing for Electronics Packaging,” Dr. Charles Chung, IBM Quantum Industry Consultant,  April 4/5, 2022 (members only; requires log-in)
• Packaging Tech Topic: Proliferation & Advancement of Metal TIMs in High Performance Computing (members only) (March 8) — iNEMI’s March Packaging meeting focused on metal thermal interface materials (TIMs) and the role they are playing in managing heat dissipation in high-performance IC packages. Tim Jensen, Global Account Manager and Senior Thermal Technologist for Indium Corporation, discussed the needs of several package styles and their heat dissipation challenges. He also talked about several different categories of metal TIMs and which might be the most appropriate for a given application.
• Packaging Tech Topic Webinar: Quantum Computing for Electronics Packaging (members only) — Quantum computing has matured to the point that quantum computers may be applied to help solve some of the biggest challenges in electronics packaging and assembly. In this webinar, Dr. Charles Chung, IBM Quantum Industry Consultant, discussed major application areas of quantum computing, example use cases for electronics packaging, and a quantum computing roadmap. He also recommended actions for the electronics packaging and assembly industry today. 

2021 iNEMI Tech Topic Series: Advanced Packaging
(these presentations are available to members only, unless otherwise noted)

• “EMIB: The Bridge on the Substrate — Enabling Next-Generation Products,” Sandeep Sane, (Intel), December 15, 2021 
• “Fan-out Panel Level Packaging,” Cheng-Ta Ko (Unimicron), January 27, 2021
• “Microprocessor Power Delivery — Challenges & Solutions,” Kaladhar Radhakrishnan (Intel),  November 24, 2021 
• “Status and Trends in Fan-Out Wafer and Panel-Level Packaging,“ Dr. Tanja Braun (Fraunhofer IZM), October 27, 2021 
• “Advanced Packages with Memory Integration Solutions,” Dr. Yu-Po Wang (SPIL — Siliconware Precision Industries Co., Ltd), September 29, 2021
• “High Speed and High Frequency Applications Enabled by Advanced Packaging Materials,” Kirk Thompson and Michael Gallagher (DuPont Electronics and Industrials), August 25, 2021 (presentation not available)
• “Matched Material Solutions for Power Electronics,” Aarief Syed-Khaja (Heraeus), July 28, 2021   
• “Wire-Bond Capacitance Test with Real-Time Prescriptive DPAT,” Derek Ong & Jeremy Pemberton-Pigott (Keysight Technologies), June 23, 2021 
• “New Packaging and Mounting Technology of MLCC,” Kazuma Noguchi (Murata Manufacturing Co., Ltd), May 26, 2021 
• “Analytical Technologies of Advanced Packages Interconnection and Joint Quality,” Dr. Endo (Toray Research Center), March 24, 2021  
• “Cu Bonding Technology: Use Cases and Prospects,” Professor Chuan Seng Tan (Nanyang Technological University), February 24, 2021 (presentation available to public)

Webinar & Conference Presentations

• Package Warpage Prediction and Characterization Project, Phase 6 Call-for-Participation Webinar (January 10, 2023) 
• “Low Temperature Material for 1st Level Interconnect in Semiconductor Packaging,” Sze Pei Lim, Indium Corporation, Electronics Packaging Technology Conference (EPTC), December 9, 2022; Singapore) (members only; requires log-in)
• PLP Fine Pitch Substrate Inspection/Metrology, Phase 4 — Survey Report: Use of AOI to Inspect Fine Pitch Circuit Patterns (October 28, 2022; members only)
• “The Effects of Voids on Solder Joint Reliability in First Level Interconnect,” presented by Sze Pei Lim (Indium), representing iNEMI’s 1st Level Interconnect Void Characterization project, International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT), Session S12: Advanced Bonding and Interconnect Technology, October 27, 2022 (Taipei, Taiwan). 
• Task Force Report on Low Temperature Material for 1st Level Interconnect
  • Webinar: Report on Low Temperature Material for 1st Level Interconnect (June 27 & 28)
  • White paper: Low Temperature Materials for Packaging First Level Interconnect (August 1, 2022) (currently available to iNEMI members only; log-in required).  
• ​1st Level Interconnect Void Characterization Project, Phase 2 End-of-Project Webinar (June 15 & 16, 2022)
• “Influence of Micro-Voids in Flip Chip Bump on Electromigration Reliability,” Kei Murayama (Shinko), Session 26: Soldered and Sintered Interconnections, 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC), June 3, 2022, San Diego (Please note: we do not have permission to post these presentations; please check with IEEE for conference proceedings.)
• “Fine Pitch Circuit Pattern Inspection Capability Study for Fan-out Wafer Level Packaging,” Feng Xue, IBM, Session WA1-1: iNEMI Session, May 11, 2022, 2022 International Conference on Electronics Packaging (ICEP 2022)
• “Extending the High Temperature Hygroscopic Swelling Characterization Limits,” Ian Chin, Intel, Session WA1-2: iNEMI Session, May 11, 2022, 2022 International Conference on Electronics Packaging (ICEP 2022)
• “Voids in First-Level Interconnects and Their Impact to Solder Joint Reliability,” Kor Oon Lee, Intel, Session WA1-3: iNEMI Session, May 11, 2022, 2022 International Conference on Electronics Packaging (ICEP 2022)
• “Low Temperature Interconnects in 1st Level Packaging and its Challenges,” Charles Arvin, IBM, Session WA1-4: iNEMI Session, May 11, 2022, 2022 International Conference on Electronics Packaging (ICEP 2022)
• High Density Interconnect Socket Warpage Prediction and Characterization End-of-Project Webinar (April 28 & 29, 2022)
• Panel Level Package Fine Pitch Substrate Inspection/Metrology Project Call-for-Participation Webinar (January 20 & 21, 2022) 
• Moisture Induced Expansion Metrology for Packaging Polymetric Materials Call-for-Participation Webinar (January 17 & 18, 2022) 
• 1st Level Interconnect Void Characterization Project, Phase 1 Report Webinar, February 3 & 4, 2021     
• Call-for-Participation: RDL Adhesion Strength Measurement Project, March 2&3, 2021
• “Voids Inspection Capability Study in First-Level Interconnections for Flip Chip Packages,” presented by Kor Oon Lee (Intel), iNEMI Session at ICEP, May 13, 2021 (virtual event)
• “Low Temperature 1st Level Interconnect in Packaging and Its Challenges,” presented by Sze Pei Lim (Indium), iNEMI Session at ICEP, May 13, 2021  (virtual event)  
• “Numerical and Experimental Studies on Warpage of Flat Panel Packages,” Franco Costa (Autodesk), Classic Program Session: EPSDI Tailoring Polymers for Targeted Performance, SPE ANTEC 2021, May 17, 2021 (virtual event) (members only)
• End-of-Project Webinar: Wafer/Panel Level Fine Pitch Substrate Inspection/Metrology Project, Phase 3, August 26 & 27, 2021 (members only)
• “Organic Panel Fine Circuit Pattern Inspection and Metrology for Readiness,” Feng Xue (IBM Singapore), EPTC, December 1-31, 2021 (virtual event) (members only)
• “Fine Pitch Designed Substrate Inspection/Metrology for Advanced Packages,” Alison Lin (Unimicron), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan) 
• 2020 iNEMI Packaging Technical Plan v 2.1 (members only)
  • Technical Plan
  • Webinar presentation: 2020 Packaging Technical Plan — Packaging Technology Challenges and Recommendations (February 12, 2020; members only)

 

PCB & Laminates

• Call-for-Participation Webinar: Hybrid PCBs for Next Generation Applications Project (December 7, 2022) 
• Call-for-Participation Webinar Presentation: PCB Characterization for CAF and ECM Failure Mitigation (September 7 & 8, 2022)
• Hybrid PCB Survey Results Webinar (April 26 & 27, 2022)
• Call-for-Participation: Reliability & Loss Properties of Copper Foils for 5G Applications, May 27 & 28, 2021     
• “Reliability & Loss Properties of Copper Foils for 5G Applications,” Ed Kelley (Isola Group), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan)

 

Roadmap

• “Roadmapping for Advanced Packaging & Heterogenous Integration: iNEMI’s Perspective,” Francis Mullany (iNEMI), iNEMI Roadmap Workshop Session, ASME InterPACK 2022, October 25 (Garden Grove, California).
• The iNEMI Roadmap Refresh: From Lord of the Rings to Wikipedia, March 3 & 4, 2022
• Relaunching the iNEMI Roadmap, Shekhar Chandrashekhar (iNEMI), IPC APEX EXPO 2022 (January 26, 2022; San Diego, California).
• iNEMI Roadmap Refresh Webinar, April 13, 2021

 

Smart Manufacturing

2022 iNEMI Tech Topic Series: Smart Manufacturing

• “Visual Data Enables Surgical Traceability by the Power of AI and Big Data,” Dr. Eyal Weiss, Cybord, September 8, 2022
• “Closed-Loop Inspection Solutions Powered by AI,” Ivan Aduna, Koh Young Technology, June 8, 2022
• “The Global Smart Industry Readiness Index (SIRI) Initiative,” Ben Ong, World Economic Forum, May 12, 2022   

Webinar & Conference Presentations

• iNEMI Survey Report: AI Enhancement to AOI for PCB Assembly (October 25, 2022)
• Call-for-Participation: Development of an Imaging AOI + AI Ecosystem (September 1 & 2)
• iNEMI Smart Manufacturing Series: Visual Data Enables Surgical Traceability by the Power of AI and Big Data, September 8,2022 
• ​Call-for-Participation Webinar Presentation: Development of an Imaging AOI + AI Ecosystem Project, September 1 & 2, 2022
• Call-for-Participation Webinar Presentation: Unified Equipment Interaction Methodology Project 
• “Industry 4.0 Adoption: A Journey in Smart Supply Chain and Smart Factory,” Feng Xue (IBM/Singapore), Emerging Technologies-2 Track, ICEP, May 12, 2021 (virtual event) 
• “Electronics Manufacturing — A Key to Smart Manufacturing Success,” featured speaker Shekhar Chandrashekhar (iNEMI), International Conference for Electronics Hardware Enabling Technologies (ICEHET), June 2, 2021 (virtual event)
• End-of-Project Webinar: Smart Manufacturing: Data Management Best Practices for PCB Assembly, September 30, 2021 
• “Can Companies Benefit from AI in a Smart Manufacturing Environment?” panel moderated by iNEMI Board Member Chan Pin Chong (Kulicke & Soffa) and featuring iNEMI Board Members Ranjan Chatterjee (Cimetrix) and Daniel Gamota (Jabil) as panelists, Electronics Packaging Technology Conference (EPTC), December 7, 2021 (virtual event) 
• End-of-Project Webinar: Back End Commonality for Advanced Packaging (Large Form Factor), December 15, 2021)

 

Sustainable Electronics

Tech Topic Series: Eco-Design for Circular Electronics Economy

• Eco-Design Tech Topic Series: Lessons Learned, Julio Vargas, IBM,  March 17, 2022 
• Session #6 — Jan Daem (Barco), November 4, 2021
• Session #5 — Nirav Patel (Framework) (October 14, 2021)
• Eco-Design for Circular Electronics Economy Series Report, October 12 & 13, 2021
• Session #4 — David Schönmayr (Fronius) and Maxwell Giammona (IBM Almaden Research Center), September 9, 2021
• Session #3 — Klaus Grobe (ADVA Optical) and Katie Morgenroth & Adi Narayanan (Google), July 27, 2021     
• Session #2 — Christophe Garnier (Schneider Electric) and Miquel Ballester & Thea Kleinmagd (Fairphone), June 17, 2021      
• Session #1 — Pia Tanskanen (Nokia) and Mark Newton (Samsung North America), May 25, 2021      

Webinar, Conference Presentations & Reports

• LCA Estimator Q&A Webinar (January 17, 2023)
• iNEMI Sustainable Electronics TIG Webinar: Autonomous Industrial Monitoring — Vertical Farming and Beyond, presented by Tom Okrasinski (Nokia Bell Labs), Chair of the iNEMI Sustainable Electronics Technology Integration Group, January 11, 2023.
• Extended Reliability Assessment for Electronic Components
  • Phase 1 Project Report
  • Phase 1 End-of-Project Webinar Presentation (October 27 & 28)
• “Sustainability Challenges for Electronic Manufacturing,” Tom Okransinski (Nokia) and Carol Handwerker (Purdue University), NextFlex Winter Flexible Hybrid Electronics (FHE) Symposium, NextFlex Technical Council Meeting (March 3, 2022; San Jose, California).
• Eco-Design Practices for Circular Electronics Economy Series — Final Video Report (February 2022)
• Project Kick-Off Webinar:  Extended Reliability Assessment for Electronics Components, October 19, 2021 
• “Eco-Design Best Practices for a Circular Electronics Economy,” Mark Schaffer (iNEMI), Chemical Watch’s Global Electronics Summit, September 22, 2021
• End-of-Project Webinar: Eco-Impact Estimator, Phase 3, September 21 & 22, 2021
• Call-for-Participation: Extended Reliability Assessment for Electronic Components Project, Juan Dominguez (Intel), August 2 & 3, 2021