Papers & Presentations

5G/mmWave

2021 iNEMI Tech Topic Series: 5G/mmWave


Webinar/Conference Presentations & Reports
  • Microwave & Radar Week (MRW) 2022 (September 12-17; Gdansk, Poland)
    These presentations are available to iNEMI members only; log-in required to download. 
    • iNEMI Workshop on Microwave and Millimetre-Wave Characterization of Dielectric Sheets: presentations by Dr. Marzena Olszewska-Placha (QWED, Bartlomiej Salski (Warsaw University of Technology) and Michael Hill, PhD (Intel)
    •  Conference Keynote: “Correlating mmWave Permittivity Measurement Tools with an Introduction to Intel’s Metrology Capability Analysis,” Michael Hill, PhD (Intel)
  • “Modelling Insights into the Recent Assessment of Materials for 5G Applications,” Dr. Marzena Olszewska-Placha (QWED), 2022 IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO), July 6-8; Limoges, France
  • Industry Workshop / Session IWTH3: Materials Characterization and Assessment for 5G-mmWave Applications, IEEE’s International Microwave Symposium (IMS), June 22, 2022, Denver, Colorado USA
    • “Review of 5G Industry Needs in Terms of Materials Characterization,” Say Phommakesone (Keysight Technologies)
    • “EM Performance” (illustrated with full-wave electromagnetic simulations), Malgorzata Celuch (QWED)
    • “Review of the iNEMI Round-Robin Materials Characterization Results,” Marzena Olszweska-Placha (QWED) and Lucas Enright (NIST)
    • “Best Practices and Recommendations for Development of Standard Reference Materials,” Nate Orloff (NIST) and Urmi Ray (iNEMI)
  • “Materials Characterization and Assessment for 5G/mmWave Applications,” presented by Malgorzata Celuch (QWED) and Say Phommakesone (Keysight Technologies), Microapps Seminar TUMA28, IEEE’s International Microwave Symposium (IMS), June 21, 2022, Denver, Colorado, USA. 
  • 5G/mmWave Materials Assessment & Characterization End-of-Project Webinar (June 2, 2022)
  • mmWave Permittivity Reference Material Development Project Call-for-Participation Webinar (May 5, 2022)
  • iNEMI 5G/mmWave Presentations at Device Packaging Conference (March 8; Fountain Hills, Arizona USA)   (Please note: we do not have permission to post these presentations; please check with iMAPS for conference proceedings.)
    • Industry Challenges for Low Loss Measurements, Urmi Ray (iNEMI) and Say Phommakesone  (Keysight)
    • Key Highlights from iNEMI 5G Project, Michael Hill (Intel)
    • 5G Electronics: Bridging the Measurement Challenges, Magorzata Celuch and Marzena Olszewska-Placha (QWED)
    • mmWave Reference Material Development at NIST, Nathan Orloff (NIST)
  • 5G/mmWave Materials Assessment and Characterization Project, Report 3: A Round Robin Study to Determine Measurement Accuracies of Commercial Resonator-Based Techniques (January 2022; members only) 
  • "Innovative Approaches to Solve Low Loss Materials Characterization Challenges," invited presentation, Urmi Ray (iNEMI), Electronic Materials and Applications 2022, Session S13: 5G Materials and Applications Telecommunications — Metrology and Characterization of Materials, January 22, 2022, virtual event).
  • Importance of Materials Characterization for 5G and Beyond,” Say Phommakesone (Keysight Technologies), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan) 
  • 5G/mmWave Material Characterization” Chang-Sheng Chen (ITRI), iNEMI Session at IMPACT, December 21, 2021 (Taipei, Taiwan)
  • “Measuring Complex Permittivity for 5G/mmWave Materials,” Hanna Kähäri (Nokia), Session 3.1: Equipment and Materials for Enabling High Performance, Connecting Heterogeneous Systems Summit, September 1, 2021 (virtual event) 
  • “Solving High Frequency Materials Characterization Challenges in 5G Electronics,” Urmi Ray (iNEMI), webinar sponsored by the International Wireless Industry Consortium (IWIC), June 16, 2021 
  • “5G/High Frequency Materials Test Challenges: Closing the Gaps via E2E Supply Chain Collaborative Innovation,” Urmi Ray (iNEMI), NIST Workshop: Securing the 5G Supply Chain through Measurement, Potential Adoption Paths for Measurements in 5G Hardware Security Session, May 19, 2021
  • High Frequency Measurements Using Wafer Level TechniquesMeasuring Low dK/dFMaterials from 1 GHz to 1 THz,” presented by Nathan Orloff (NIST), iNEMI session at ICEP, May 13, 2021 (virtual event)
  • 5G Electronics Challenges: High Frequency Materials Characterization, iNEMI Invited Session at the International Conference on Device Packaging, April 14, 2021 (virtual event), International Microelectronics Assembly and Packaging Society (iMAPS)
    Session Chair: Urmi Ray (iNEMI)
    Presentations and speakers:
    • Challenges for High Dk/Df Measurements,” Urmi Ray (iNEMI)
    • Benchmarking Resonator based Low Dk/Df Material Measurements,” Richard Stephenson (EMD Electronics)
    • Recent Developments of Resonator Measurements for Emerging Materials and Technologies,” Magorzata Celuch & Marzena Olszewska-Placha (QWED)
    • High Frequency Measurements Using Wafer Level Techniques,” Nathan Orloff (NIST)
    • Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements,” Say Phommakesone and Daisuke Kato (Keysight Technologies)
  • iNEMI Technical Session: 5G/High Frequency Materials Characterization Challenges and Opportunities, IPC APEX EXPO, March 12, 2021, moderated by Urmi Ray (iNEMI) March 12, 2021
    • "High Frequency Measurements using Wafer Level Techniques," Nathan Orloff (NIST)
    • "Benchmarking Resonator Based Low Dk/Df Material Measurements," Michael Hill (Intel) and Malgorzata Celuch (QWED). 
    • "Optimizing Measurement Accuracy and Repeatability for High Frequency Measurements," Say Phommakesone and Daisuke Kato (Keysight)
  • 5G/High Frequency Materials Characterization Challenges and Opportunities,” Urmi Ray (iNEMI), Electronic Materials and Applications (EMA) Conference, American Ceramic Association (January 22, 2021; virtual event).
  • 5G/mmWave Materials Assessment and Characterization Project, Report 1: Benchmark Current Industry Best Practices for Low Loss Measurements (November 2020; members only)  
  • 5G/mmWave Materials Assessment and Characterization Project, Report 2: Benchmark Emerging Industry Best Practices for Low Loss Measurements (November 2020; members only)  

Board Assembly 

2021 iNEMI Tech Topic Series: Board Assembly


Webinar & Conference Presentations  
Miscellaneous Optoelectronics  

Packaging

Packaging Technology Integration Group (TIG)
2022 iNEMI Tech Topic Series: Advanced Packaging
(these presentations are available to members only, unless otherwise noted)
  • Packaging Tech Topic Series: “Application-Specific Qualification for Electronics,” David Locker, Jr., U.S. Army Aviation and Missile Center, May 17, 2022 (members only — requires log-in). 
  • Packaging Tech Topic Webinar: “Quantum Computing for Electronics Packaging,” Dr. Charles Chung, IBM Quantum Industry Consultant,  April 4/5, 2022 (members only; requires log-in)
  • Packaging Tech Topic: Proliferation & Advancement of Metal TIMs in High Performance Computing (members only) (March 8) — iNEMI’s March Packaging meeting focused on metal thermal interface materials (TIMs) and the role they are playing in managing heat dissipation in high-performance IC packages. Tim Jensen, Global Account Manager and Senior Thermal Technologist for Indium Corporation, discussed the needs of several package styles and their heat dissipation challenges. He also talked about several different categories of metal TIMs and which might be the most appropriate for a given application.
  • Packaging Tech Topic Webinar: Quantum Computing for Electronics Packaging (members only) — Quantum computing has matured to the point that quantum computers may be applied to help solve some of the biggest challenges in electronics packaging and assembly. In this webinar, Dr. Charles Chung, IBM Quantum Industry Consultant, discussed major application areas of quantum computing, example use cases for electronics packaging, and a quantum computing roadmap. He also recommended actions for the electronics packaging and assembly industry today. 

2021 iNEMI Tech Topic Series: Advanced Packaging
(these presentations are available to members only, unless otherwise noted)
Webinar & Conference Presentations  

PCB & Laminates

 

Roadmap

 

Smart Manufacturing

2022 iNEMI Tech Topic Series: Smart Manufacturing Webinar & Conference Presentations  

Sustainable Electronics

Tech Topic Series: Eco-Design for Circular Electronics Economy
  • Eco-Design Tech Topic Series: Lessons Learned, Julio Vargas, IBM,  March 17, 2022 
  • Session #6 — Jan Daem (Barco), November 4, 2021
  • Session #5 — Nirav Patel (Framework) (October 14, 2021)
  • Eco-Design for Circular Electronics Economy Series Report, October 12 & 13, 2021
  • Session #4 — David Schönmayr (Fronius) and Maxwell Giammona (IBM Almaden Research Center), September 9, 2021
  • Session #3 — Klaus Grobe (ADVA Optical) and Katie Morgenroth & Adi Narayanan (Google), July 27, 2021     
  • Session #2 — Christophe Garnier (Schneider Electric) and Miquel Ballester & Thea Kleinmagd (Fairphone), June 17, 2021      
  • Session #1 — Pia Tanskanen (Nokia) and Mark Newton (Samsung North America), May 25, 2021      
Webinar, Conference Presentations & Reports