Speakers Bios: Advanced Packaging and its Impact on mm/Wave Applications
David Citrin is a Professor of Electrical and Computer Engineering at the Georgia Institute of Technology. In addition, he is Project Coordinator on Nonlinear Optics and Dynamics at Georgia Tech-CNRS UMI 2958 located at Georgia Tech-Lorraine (France).
Professor Citrin joined the faculty at Georgia Tech in 2001 where his work focuses on terahertz technology and nanotechnology. He is a former Associate Editor of the IEEE Journal of Quantum Electronics. He was a recipient of a Presidential Early Career Award for Scientists and Engineers (PECASE), an award under the US Office of Naval Research Young Investigator Program (YIP), and of a Friedrich Bessel Prize from the Alexander von Humboldt Stiftung.
Professor Citrin earned a B.A. from Williams College (1985) and an M.S. (1987) and Ph.D. (1991) from the University of Illinois, all in physics. His dissertation was on the optical properties of semiconductor quantum wires. Subsequently, he was a post-doctoral research fellow at the Max Planck Institute for Solid State Research, Stuttgart, Germany (1992-1993) and Center Fellow at the Center for Ultrafast Optical Science at the University of Michigan (1993-1995). Dr. Citrin was an assistant professor of physics and materials science at Washington State University (1995 to 2001).
Lucas Enright is a PhD student in Materials Science at the Colorado School of Mines and a Professional Research Experience Program (PREP) Associate for the National Institute of Standards and Technology (NIST), working with the NIST Communications Technology Laboratory, Guided Wave Electromagnetics Group in Boulder Colorado. His work with NIST has been on the development of standard reference materials for mmWave dielectrics. He was also a Graduate Teaching Assistant for Properties and Processing of Ceramics (Colorado School of Mines) and had a Quantum Engineering Fellowship, Quantum Engineering NSF Traineeship.
Prior to entering the doctoral program at the School of Mines, Lucas was an Undergraduate Teaching Assistant for Applied Thermodynamics of Materials at the University of Connecticut and an Undergraduate Research Assistant working on projects in FEM modeling of electric and magnetic phenomena in materials, as well as in microstructure characterization of concrete. He earned his BSE, Materials Science and Engineering from the University of Connecticut.
Lucas has published several papers and made several conference presentations. He received the Ken Hass Outstanding Student Paper Award in 2023 from the American Physical Society – Forum on Industrial and Applied Physics. He also received recognition as a student speaker for papers presented at the American Ceramics Society’s Electronic Materials and Applications Conferences in 2022 and 2020. He is a member of the American Ceramics Society, Institute of Electrical and Electronics Engineers, International Microelectronics Assembly and Packaging Society and American Physical Society.
Lisa Fronczek is the Competition Manager at the National Institute of Standards and Technology (NIST) Office of Advanced Manufacturing (OAM). Since joining NIST in 1987, Lisa spent her first ten years working on U.S. Navy-funded projects where she applied her manufacturing engineering research expertise to support the design and development of software and hardware automation systems. Lisa went on to support various directors of NIST’s Manufacturing Engineering Laboratory as the Scientific Advisor for over ten years, and to be a member of a multi-agency team that tested and developed military-relevant handheld equipment and client applications. Lisa has been awarded the U.S. Department of Commerce Gold Medal, the highest award presented by the U.S. Secretary of Commerce, for leadership of a multi-organization effort to develop innovative methods to securely deploy smartphones and other applications. She has also been recognized for exceptional initiative and collaborative success in managing the Summer Undergraduate Research Fellowship (SURF) program at NIST. While working in the NIST Manufacturing Engineering Laboratory, Lisa also developed several expert papers, videos, and workshops on collaborative manufacturing robots and other topics. As the OAM Competition Manager, Lisa successfully chaired the first NIST Manufacturing USA Institute award competition. Lisa received a B.S. in Electrical Engineering from the University of Maryland.
Habib Hichri is Vice President, Senior Fellow Global Applications and Business Development at Ajinomoto Fine-Techno Corporation USA. Prior to joining AFT USA, Habib was Director of Applications Engineering at SUSS MicroTec Photonics Systems USA where he provided patterning solutions for advanced semiconductors packaging customers. Before joining SUSS MicroTec, Habib spent about 12 years with IBM Semiconductors Research and Development Center (IBM SRDC) in East Fishkill, NY where he worked as lead process integration engineer for microprocessor (IBM), games and communications chips. He later was promoted to management positions within IBM on process development in the front end of line area for microprocessor fabrication.
Habib holds over 146 U.S. patents and authored over 67 publications and presentations and a book chapter in “Advances in Embedded and Fan-Out Wafer Level Packaging Technologies” (Wiley - IEEE) first Edition. Habib received Master and PhD degrees in Chemical Engineering from the Claude Bernard University at Lyon, France, and an MBA degree from the State University of New York at Buffalo. Habib is chair of the Orange County California IEEE/Electronic Packaging Society (EPS) Chapter. He is also a member of the technical committees of Electronic Components and Technology Conference (ECTC), International Microelectronics Assembly and Packaging Society (IMAPS) and Wafer Level Packaging Symposium (WLPS). He was the general chair of IMPAS 2020. Habib is a fellow of IMAPS Society.
Prior to joining Intel, Michael was involved in development of high density active microwave phased arrays for medical applications, and later in the development of wireless networking hardware and characterization systems utilizing spherical near-field scanning techniques.
Michael is a senior member of the IEEE, has authored more than 30 peer reviewed publications, holds 9 patents and is a member of Tau Beta Pi and Etta Kappa Nu. He holds B.S., M.S. and Ph.D. degrees in Electrical Engineering from the University of Arizona.
Ravi Parthasarathy, M.S.Ch.E., is an experienced Senior Application Engineer at ZESTRON Americas. Ravi addresses critical cleaning challenges in the electronics manufacturing industry with active involvement in industry organizations and extensive technical contributions. He has collaborated on case studies with manufacturers, cleaning equipment providers, and solder paste suppliers and has authored technical articles for industry journals. Ravi’s expertise led to his appointment to the STMA Global Board of Directors and his role as Vice-Chair for the IPC 5-31J Cleaning Committee Task Group.
Ravi holds a bachelor’s degree in chemical engineering from the University of Mumbai and a master’s in chemical & natural gas engineering from Texas A&M University. Ravi has been a valuable member of ZESTRON Americas since 2004.
He is a former Chair of the Nanopackaging Technical Committee, Former EPS Representative of IEEE Nanotechnology Council, an IEEE Distinguished Lecturer in Nanotechnology for 2020-2021, General Chair for 3D PEIM 2023, and Associate Editor for IEEE Nanotechnology Magazine and Transactions of Components, Packaging and Manufacturing Technologies (T-CPMT).
Raj has 360 publications, including more than 25 best paper awards, and he holds 8 patents. He has a PhD from Rutgers University in Ceramic Engineering, an ME from the Indian Institute of Science (Bangalore), and a BS from the Indian Institute of Technology (Kanpur).
Prior to joining iNEMI, she was Senior Director at JCET Group, focused on advanced system-in-package (SIP) technologies. She also had a 10+year career at Qualcomm, where she was a Principal Engineer and the technology and program lead in several forward-looking programs in 3D and 2.5D, system integration and fan-out wafer level packaging with particular focus on low-cost packaging for the mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in New Jersey, working on advanced materials and reliability for a diverse set of product portfolios, from consumer products to high-reliability telecommunications projects. Urmi has a PhD from Columbia University (New York City).
Madhu Stemmermann is CEO and founder of SunRay Scientific. She has 25 years of experience in senior leadership roles across manufacturing, supply chain, sales and product management spanning various industries such as electronics packaging, conductive adhesives, medical devices, LED lighting and engineered plastics. She was the youngest and first female plant manager appointed at Philips Lighting. She has led and executed various company transformations and acquisitions. Madhu received her degree in Chemical Engineering from Purdue University, West Lafayette, IN.
Prior to joining Penn State University, he was with Georgia Tech, where he served as the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC). Prior to Georgia Tech, he was with IBM working on packaging for supercomputers.
Dr. Swaminathan is the author of 550+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of three books and five book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He is the recipient of the 2024 IEEE Rao R. Tummala Electronics Packaging Award (IEEE Technical Field Award) for contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems. He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.