Speakers Bios: Advanced Packaging and its Impact on mm/Wave Applications

Lucas Enright, National Institute of Standards and Technology

Lucas Enright is a PhD student in Materials Science at the Colorado School of Mines and a Professional Research Experience Program (PREP) Associate for the National Institute of Standards and Technology (NIST), working with the NIST Communications Technology Laboratory, Guided Wave Electromagnetics Group in Boulder Colorado. His work with NIST has been on the development of standard reference materials for mmWave dielectrics. He was also a Graduate Teaching Assistant for Properties and Processing of Ceramics (Colorado School of Mines) and had a Quantum Engineering Fellowship, Quantum Engineering NSF Traineeship.

Prior to entering the doctoral program at the School of Mines, Lucas was an Undergraduate Teaching Assistant for Applied Thermodynamics of Materials at the University of Connecticut and an Undergraduate Research Assistant working on projects in FEM modeling of electric and magnetic phenomena in materials, as well as in microstructure characterization of concrete. He earned his BSE, Materials Science and Engineering from the University of Connecticut.

Lucas has published several papers and made several conference presentations. He received the Ken Hass Outstanding Student Paper Award in 2023 from the American Physical Society – Forum on Industrial and Applied Physics. He also received recognition as a student speaker for papers presented at the American Ceramics Society’s Electronic Materials and Applications Conferences in 2022 and 2020.

He is a member of the American Ceramics Society, Institute of Electrical and Electronics Engineers, International Microelectronics Assembly and Packaging Society and American Physical Society.    


Michael J. Hill, PhD, Intel Corporation

Michael is a Principal Engineer at Intel Corporation in Chandler, Arizona. He has been with the Electrical Core Competency group since 2002. His work in this area includes the development of new tools and techniques to allow precise characterization of substrate electrical performance metrics spanning power delivery, highspeed I/O and RF applications. Much of his recent work has focused on metrologies for characterizing high speed integrated voltage regulators. In addition to his work in Power Delivery, Michael is also responsible for developing characterization methods for package material sets spanning DC to 110GHz. 

Prior to joining Intel, Michael was involved in development of high density active microwave phased arrays for medical applications, and later in the development of wireless networking hardware and characterization systems utilizing spherical near-field scanning techniques. 

Michael is a senior member of the IEEE, has authored more than 30 peer reviewed publications, holds 9 patents and is a member of Tau Beta Pi and Etta Kappa Nu. He holds B.S., M.S. and Ph.D. degrees in Electrical Engineering from the University of Arizona. 


Shelby F. Nelson, Ph.D, Mosaic Microsystems

Shelby is CTO of Mosaic Microsystems. She is a semiconductor device physicist with broad industrial research experience. Her work has included ferroelectric materials at AT&T Bell Labs, silicon/germanium heterostructures at IBM’s Thomas J. Watson Research Center, and a mixed-signal CMOS process for ink-jet ejector heads at Xerox Corporation. In addition, Dr. Nelson spent 16 years as a Senior Research Scientist in the area of thin-film and printed electronics at the Kodak Research Labs.



Ravi Parthasarathy, ZESTRON Americas

Ravi Parthasarathy, M.S.Ch.E., is an experienced Senior Application Engineer at ZESTRON Americas. Ravi addresses critical cleaning challenges in the electronics manufacturing industry with active involvement in industry organizations and extensive technical contributions. He has collaborated on case studies with manufacturers, cleaning equipment providers, and solder paste suppliers and has authored technical articles for industry journals. Ravi’s expertise led to his appointment to the STMA Global Board of Directors and his role as Vice-Chair for the IPC 5-31J Cleaning Committee Task Group.

Ravi holds a bachelor’s degree in chemical engineering from the University of Mumbai and a master’s in chemical & natural gas engineering from Texas A&M University. Ravi has been a valuable member of ZESTRON Americas since 2004.


Markondeya Raj Pulugurtha, PhD, Florida International University

Raj is an Associate Professor in the Biomedical Engineering and Electrical and Computer Engineering departments at FIU. He has 20 years of experience in power, RF/mmWave and sensor packaging, along with expertise in passive components, 3D package integration, wireless biosensors.  

He is a former Chair of the Nanopackaging Technical Committee, Former EPS Representative of IEEE Nanotechnology Council, an IEEE Distinguished Lecturer in Nanotechnology for 2020-2021, General Chair for 3D PEIM 2023, and Associate Editor for IEEE Nanotechnology Magazine and Transactions of Components, Packaging and Manufacturing Technologies (T-CPMT). 

Raj has 360 publications, including more than 25 best paper awards, and he holds 8 patents. He has a PhD from Rutgers University in Ceramic Engineering, an ME from the Indian Institute of Science (Bangalore), and a BS from the Indian Institute of Technology (Kanpur).


Urmi Ray, PhD, iNEMI

Urmi Ray is a project manager for iNEMI and manages the consortium’s 5G/mmWave Materials Assessment and Characterization and mmWave Permittivity Reference Material Development projects. She is also Principal investigator for the 5G/6G mmWave Materials and Electrical Test Technology Roadmap (5G/6G MAESTRO), part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap program, which is administered by iNEMI.

Prior to joining iNEMI, she was Senior Director at JCET Group, focused on advanced system-in-package (SIP) technologies. She also had a 10+year career at Qualcomm, where she was a Principal Engineer and the technology and program lead in several forward-looking programs in 3D and 2.5D, system integration and fan-out wafer level packaging with particular focus on low-cost packaging for the mobile industry. She joined Qualcomm in 2006, after spending 10+ years at Lucent Technologies Bell Laboratories in New Jersey, working on advanced materials and reliability for a diverse set of product portfolios, from consumer products to high-reliability telecommunications projects. 

Urmi has a PhD from Columbia University (New York City).


Madhavan Swaminathan, PhD, The Pennsylvania State University

Madhavan Swaminathan is the Department Head of Electrical Engineering and the William E. Leonhard Endowed Chair at Penn State University. He also serves as the Director for the Center for Heterogeneous Integration of Micro Electronic Systems (CHIMES), an SRC JUMP 2.0 Center www.chimes.psu.edu.

Prior to joining Penn State University, he was with Georgia Tech, where he served as the John Pippin Chair in Microsystems Packaging & Electromagnetics in the School of Electrical and Computer Engineering (ECE), Professor in ECE with a joint appointment in the School of Materials Science and Engineering (MSE), and Director of the 3D Systems Packaging Research Center (PRC). Prior to Georgia Tech, he was with IBM working on packaging for supercomputers. 

Dr. Swaminathan is the author of 550+ refereed technical publications and holds 31 patents. He is the primary author and co-editor of three books and five book chapters, founder and co-founder of two start-up companies, and founder of the IEEE Conference on Electrical Design of Advanced Packaging and Systems (EDAPS), a premier conference sponsored by the IEEE Electronics Packaging Society (EPS). He is a Fellow of IEEE, Fellow of the National Academy of Inventors (NAI), and has served as the Distinguished Lecturer for the IEEE Electromagnetic Compatibility (EMC) society. He is the recipient of the 2024 IEEE Rao R. Tummala Electronics Packaging Award (IEEE Technical Field Award) for contributions to semiconductor packaging and system integration technologies that improve the performance, efficiency, and capabilities of electronic systems.

He received his MS and PhD degrees in Electrical Engineering from Syracuse University in 1989 and 1991, respectively.