2023 Presentations & Papers-Advanced Packaging

Advanced Packaging Tech Topic Series


Call-for-Participation: Package Warpage Prediction and Characterization Project, Phase 6 (January 10, 2023)             Project page
 

SMTA Wafer-Level Packaging Symposium
February 14-16, 2023 / Fremont, California 

• “RDL Adhesion Study for Advanced Packages,” Steven Martell (Nordson), Wafer-Level Packaging Symposium, Session 2: Advanced Manufacturing and Test / Test Metrology for Advanced Manufacturing (February 14, 2023: Fremont, California) (Available to members only; requires log-in). iNEMI project: RDL Adhesion Strength Measurement 

• "iNEMI Advanced Packaging Roadmapping and Challenges Ahead,” Shekhar Chandrashekhar (iNEMI) and Dan Gamota (Jabil), Wafer-Level Packaging Symposium, Session 6: Wafer-Level Packaging / Novel WLP Technology Roadmap and Dielectric Systems, February 16, 2023; Fremont, California. 

“Advanced Packaging — the Need for Standards,” Shekhar Chandrashekhar (iNEMI), International Semiconductor Executive Summit/ISES USA, March 7, 2023; Chandler, Arizona  

Call-for-participation: Low-Temperature Materials for First Level Interconnect (April 12 & 13, 2023)
Project page  
 

2023 International Conference on Electronics Packaging (ICEP)
April 19, 2023; Kyushu, Japan 

• “AOI Pattern Detection Study for Fine Pitch Advanced Substrate,” Feng Xue (IBM), Session WA1: iNEMI Session, 2023 International Conference on Electronics Packaging (ICEP), April 19, 2023; Kyushu, Japan (iNEMI members only)  
  iNEMI project: Fine Pitch Circuit Pattern Inspection/Metrology, Phase 4     
   
• “Copper Trace Adhesion Measurement Study for Advanced Substrate Circuitry Patterns,” Masahiro Tsuriya (iNEMI), Session WA1: iNEMI Session, 2023 International Conference on Electronics Packaging (ICEP), April 19, 2023; Kyushu, Japan (iNEMI members only)    
  iNEMI project: RDL Adhesion Strength Measurement    
   
• “An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305,” Sze Pei Lim (Indium Corporation), Session WA1: iNEMI Session, 2023 International Conference on Electronics Packaging (ICEP), April 19, 2023; Kyushu, Japan (iNEMI members only)  
  iNEMI project: Panel Level Package Fine Pitch Substrate Inspection/Metrology, Phase 4

“Adhesion Testing of Fine Line Patterns in Integrated Packages,” Frank Wang (Unimicron Technology Corp.), iNEMI Session, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), October 25, 2023; Taipei, Taiwan (iNEMI members only)
iNEMI project: RDL Adhesion Strength Measurement