2023 Presentations & Papers-Advanced Packaging

Advanced Packaging Tech Topic Series

Call-for-Participation: Package Warpage Prediction and Characterization Project, Phase 6 (January 10, 2023)             Project page

SMTA Wafer-Level Packaging Symposium
February 14-16, 2023 / Fremont, California 

Advanced Packaging — the Need for Standards,” Shekhar Chandrashekhar (iNEMI), International Semiconductor Executive Summit/ISES USA, March 7, 2023; Chandler, Arizona  

Call-for-participation: Low-Temperature Materials for First Level Interconnect (April 12 & 13, 2023)
Project page  


2023 International Conference on Electronics Packaging (ICEP)
April 19, 2023; Kyushu, Japan 

Adhesion Testing of Fine Line Patterns in Integrated Packages,” Frank Wang (Unimicron Technology Corp.), iNEMI Session, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), October 25, 2023; Taipei, Taiwan (iNEMI members only)
iNEMI project: RDL Adhesion Strength Measurement