2023 Presentations & Papers-Board Assembly

Low-Temperate Solder Tech Topic Series


SMTA International
October 9-12, 2023; Minneapolis, Minnesota
 

• “A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys,” Richard Coyle, PhD (Nokia Bell Labs), Session IRR1: Programs Addressing High Reliability and Mission Critical Applications, SMTA International, October 10, 2023; Minneapolis, Minnesota. (This paper was originally published in the proceedings of the SMTA International, October 9 - October 12, 2023, Minneapolis, MN USA)
  iNEMI project: Characterization of Third Generation High-Reliability Pb-Free Alloys  
  
  

• “The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects,” Dan Burkholder and Raiyo Aspandiar, Ph.D. (Intel Corporation); Session LTS1: Thermal Cycling Performance of LT Sn-Bi Solder Joints with and without Aging Low Temperature Solder, SMTA International, October 11, 2023; Minneapolis, Minnesota. (This paper was originally published in the proceedings of the SMTA International, October 9 - October 12, 2023, Minneapolis, MN USA)
  iNEMI project: BiSn-Based Low-Temperature Soldering Process and Reliability
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• “Comparison of Electromigration in Tin-Bismuth Planar and Bottom Terminated Component Solder Joints,” Prabjit Singh, Ph.D. (IBM Corporation), Session LTS3: Electromigration, Shear and Drop Shock Assessment of Low Temperature Sn-Bi Solder Joints, SMTA International, October 11, 2023; Minneapolis, Minnesota. (This paper was originally published in the proceedings of the SMTA International, October 9 - October 12, 2023, Minneapolis, MN USA)
  ​iNEMI project: Electromigration of SnBi Solder for Second-Level Interconnect

“Electromigration In TIn-Bismuth Planar Geometry Solder Joints,” Prabjit Singh, PhD (IBM), Session FE1: Solder 1, International Conference on Electronics Packaging (ICEP), April 21, 2023; Kyushu, Japan (iNEMI members only)      Paper         Presentation
iNEMI project: Electromigration of SnBi Solder for Second-Level Interconnect


“Dynamic Warpage Prediction of High-Density Interconnect Socket,” Philip Chang, PhD (CoreTech System Co., Ltd. / Moldex3D), iNEMI Session, International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), October 25; Taipei, Taiwan (iNEMI members only)
iNEMI project: High Density Interconnect Socket Warpage Prediction and Characterization


Call-for-Participation: High Density Interconnect Socket Warpage Prediction and Characterization, Phase 2 (January 4/5, 2023)     Project page