2024 Council Meeting Keynote — IC Package Substrates for Heterogenous Integration: Future Challenges and Opportunities

 

Abstract

Advanced packaging is enabling unprecedented levels of product performance as logic and memory chiplets are heterogeneously integrated in unique architectures, merging back-end silicon fabrication with package assembly. IC package substrates are a crucial component of future advanced packaging technologies to enable efficient power delivery, high-speed I/O signalling and dense, low latency die-to-die interconnections. To meet future challenges, IC substrates are evolving from fiberglass reinforced epoxy (organic) core substrates to glass core substrates. Glass has unique physical and optical properties that allow for more transistors to be delivered in a package, providing better scaling and enabling the assembly of larger chiplet complexes. In this talk, Dr. Manepalli will discuss an overview of state-of-the-art IC package substrate technologies, and future challenges and opportunities in scaling IC package substrates.
 

 

About the Speaker

Rahu Manepalli, PhD
Intel Corporation 

Dr. Manepalli is an Intel Fellow and Sr. Director of Module Engineering in the Assembly & Test Technology Development organization in Intel. Rahul and his team are responsible for developing the next generation of materials, processes and equipment for Intel’s advanced packaging efforts. He and his team have been the driving force behind many of the technology innovations in Intel’s organic package substrates, EMIB package technology and the recently unveiled glass core substrates. He has led the development of several of the industry’s first-of-a-kind processes, tool platforms and technologies from concept to high-volume manufacturing adoption. Rahul has also had an instrumental role in leading Intel’s assembly materials technologies to several innovations in encapsulants, thermal interface materials and solder alloys. He is the author of more than 240 patent publications worldwide in packaging, more than 50 technical papers and invited talks, and has been with Intel for 24 years. He has a Ph.D. in Chemical Engineering from the Georgia Institute of Technology.