Chair: Peng Su, Cisco
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Background
The use of copper wire has been growing as the price of gold has increased in recent years. The main concerns that would prevent companies using copper wire technology are in-service reliability, process yield and unproven historical performance.
This two-phased project was launched in the third quarter of 2010 to:
- Understand key issues and concerns regarding reliability of Cu wire bonding for semiconductors.
- Assess reliability performance of components with Cu bond wires and compare to components with Au bond wires.
- Identify key packaging material properties that impact reliability performance, and provide guidelines on packaging material selection.
- By using a test-to-failure methodology, assess the effectiveness of standard reliability test methods on addressing reliability risks of Cu wire bonded devices.
This project will provide the following benefits to participating companies and the industry in general:
- Reduce the need for individual member companies to run evaluation on the reliability performance of Cu-wire devices by performing these tasks collectively and sharing data openly.
- Establish potential common requirements on key materials properties for packaging materials so that all component suppliers and users have identical qualification requirements.
- Determine the suitability of using current standard JEDEC test methods and durations for the reliability performance for Cu wire devices. Recommend new testing requirements if the current common practice is found to be inadequate.
Phase 1
In Phase 1, which has been completed, participants conducted a survey on the industry-wide conversion status, as well as key reliability concerns, for Cu wire bonding. Based on the findings from this survey and published literature, it was determined that reliability performance of Cu wire bonding needs to be further evaluated with experimental work so that the effects of key factors (such as packaging material selection) on reliability performance can be better understood. Furthermore, for component qualification purposes, standard reliability test methods and durations established for Au wire device may not be appropriate for Cu. Phase 1 developed an experimental matrix that includes realistic packaging material variations for both leadframe and substrate-based packages.
Statement of Work, Phase 1 (Version 1.1, August 5, 2010)
Phase 2
Phase 2 of the Copper Wire Bonding Reliability Project will perform necessary experimental work in the areas defined during the first phase and will include realistic packaging material variations for both leadframe and substrate-based packages.
- A series of accelerated tests will be performed on components made with these material variations. Lifetime data will be collected.
- Based on the accelerated tests and failure analysis data, the effects of packaging material properties will be better understood.
- The effectiveness of current accelerated test methods and durations will also be determined.
This project will provide the following benefits to participating companies and the industry in general:
- Using Cu wire as a replacement for Au wire will bring material cost savings to the industry, but will require sufficient understanding/management of reliability issues.
- Generate lifetime data from a series of acceleration tests and perform failure analysis on components from select test methods.
- Share technical data among member companies and provide understanding of failure mechanisms and processes for Cu wire bonded components.
- Establish potential common requirements on key materials properties for packaging materials so that all component suppliers and users have identical qualification requirements.
- Determine the suitability of using current standard JEDEC test methods and durations for the reliability performance for Cu wire devices. Recommend new testing requirements if the current common practice is found to be inadequate.
Statement of Work
End-of-Project Webinar, Phase 2
Presentation: Copper Wire Bonding Reliability, Phase 2 End-of-Project Webinar (March 27, 2014) (iNEMI members only)
Presentations
For Additional Information
Haley Fu
+86 21-2215 7746 (China)
haley.fu@inemi.org |
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