Solder joints are subjected to increasingly higher thermal and mechanical loads as component size decreases and interconnect density increases. Encapsulants are used to protect components from moisture, corrosion, vibration and thermal exposure in high-reliability environments. These materials are available in a large variety of chemistries such as silicones, acrylics, urethanes and epoxies. The fatigue life of solder joints in ball grid array (BGA) components can be adversely effected by the mechanical properties of the various materials used to protect them.
This webinar presented the development of a novel specimen designed to create axial loads in solder joints. Encapsulation materials are used in the specimen as the main axial deformation driver. A modeling approach was presented based on cracking energy density tested in an effort to fit a damage parameter to TMF life of solder joints in axial loading.