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iNEMI Environmental Stakeholders Forum

November 8, 2010

(Vienna, Austria)

All presentations are PDF files.

Welcome from iNEMI

Bill Bader, CEO iNEMI

Overview of the Forum Process

Bob Pfahl, VP iNEMI

ICT Environmental Research Needs

Todd Brady, Intel

Needs for the PC Market

John Pflueger, Dell

Additional Needs for the IT Market

Joan Krajewski, Microsoft

View from the US EPA

Barbara Karn, US EPA

Research Opportunities

Nils Nissen, Fraunhofer IZM

Further Opportunities for Research

Colin Fitzpatrick, U of Limerick

Material Needs of the Electronics Industry

Hans Wendschlag, HP

Opportunities Identified by NGOs

Lauren Heine, Clean Production Action

Sustainability Opportunities

Carol Handwerker, Purdue

Summary and Highlights

Bob Pfahl, iNEMI

For further information

Bob Pfahl

bob.pfahl@inemi.org

+1 703-834-2083

Upcoming Events

12

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

10:30 AM to 11:30 AM EDT
17

Sep

iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

10:00 AM to 11:00 AM JST
17

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

11:00 AM to 12:00 PM EDT
19

Sep

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education

11:00 AM to 12:00 PM EDT
24

Sep

Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering

10:00 AM to 11:00 AM JST

View All Events