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EPTC Panel Session:
Packaging Challenges & Opportunities for 5G Applications
December 4, 2019; Singapore

 

iNEMI co-organized this panel session at the 21st Electronics Packaging Technology Conference (EPTC). A diverse panel, including Samsung Electronics, Hitachi Chemical, Fujitsu and TTM, outlined the key drivers and applications for 5G such as high-speed computing, smart phones, automotive, networking, IoT etc. The panel-led interactive session discussed many of the design and material challenges that 5G presents, including antenna-in-package (AiP) and beam-forming antenna module array with package-level integration, substrates and PCB fabrication requirements, material characterization, and measurement and test challenges. This session has contributed to the development of an ongoing iNEMI initiative on 5G mmWave material characterization and testing. Several of the presentations from the panelists can be downloaded below. 

 

Introduction/Overview

Antenna-in-Package (AiP) Technology for mmWave 5G Phased Array Chips
Prof. Yue Ping Zhang, Nanyang Technological University, Singapore

Areas of Activity
Mr. Shunichi Kikuchi, Fujitsu Advanced Technologies Limited

5G Related Activity of Hitachi Chemical
Dr. Toshihisa Nonaka, Hitachi Chemical Co., Ltd.

PCB Design and Fabrication Trends
Mr. Erkko Helminen, TTM Technologies