Event Calendar

Start Date: 10/20/2024 8:00 AM EDT
End Date: 10/24/2024 5:00 PM EDT

Venue Name: Donald E. Stephens Convention Center

Location:

Organization Name: iNEMI

Contact:

If you plan to attend the SMTA International conference this year, be sure to check out the following presentations from iNEMI project teams and the Town Hall we are co-hosting on Tuesday afternoon.

Also, iNEMI CTO Grace O’Malley (gomalley@inemi.org) will be attending SMTA International this year. Email her if you’d like to meet during the conference.
 

 

Tuesday, October 22

Session RHE1: Solder Joint Reliability
Tuesday, October 22 / 8:30-10:00 a.m. CDT
 
“The Effect of Thermal Cycling Dwell Time on Reliability of High-Performance Pb-free Solder Alloys”
Presenter: Richard Coyle, Ph.D. (Nokia Bell Labs)
iNEMI project: Characterization of Third Generation High-Reliability Pb-Free Alloys
 
 

Session MFX2: Large Panel Assembly
Tuesday, October 22 / 10:30 a.m. - 12:00 p.m. CDT
 
“iNEMI Board Assembly-Press Fit Technology Roadmap of 2023 and 10 years Beyond”
Presenter: Paul Wang, Ph.D. (MiTAC Computer Technology)
iNEMI Roadmap: https://roadmap.inemi.org/ir/

 

Session RHE4: Thermal Shock & Thermal Cycle Testing Comparisons
Tuesday, October 22 / 3:30-5:00 p.m. CDT

“A Comparison of Thermal Cycling and Thermal Shock for Evaluating Solder Joint Reliability”
Richard Coyle, Ph.D. (Nokia Bell Labs)
iNEMI project: Characterization of Third Generation High-Reliability Pb-Free Alloys
 

 

RHE Track: Technology Townhall
Thermal Cycle vs Thermal Shock Testing of Solder Joints — Is there really a difference?
Hosted by iNEMI / HDP / SMTA
Tuesday, October 22 /  5:15-6:15 p.m. 
Free and open to all attendees

iNEMI, HDP and SMTAI will host a "town hall meeting" open to all conference attendees for a wide-open interactive discussion on the topic of thermal cycle vs. thermal shock testing of solder joints. All discussion positions and opinions will be welcomed in an interactive expansive topic forum where the session attendees' questions and comments will lead the discussion. You are invited to submit questions and topics in advance to: crgdragon@gmail.com
 

Wednesday, October 23

Session LTS1: Thermal Fatigue and Mechanical Shock Reliability of LTS Solder Joints
Wednesday October 23 / 11:00 a.m. - 12:30 p.m. CDT
 
“Thermal Cycling Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Ball Grid Array Interconnects at a High Homologous Temperature”
Presenter: Richard Coyle, Ph.D. (Nokia Bell Labs)
iNEMI project: Bi-Sn Based Low-Temperature Soldering Process and Reliability

 

Thursday, October 24

Session LTS2: Electromigration in Tin-Bismuth Solders
Thursday, October 24 / 8:30-10:00 a.m. CDT
 
“Microstructural Evolution During Electromigration in Eutectic Tin-Bismuth Bottom Terminated Components Solder Joints”
Presenter: Prabjit Singh, Ph.D. (IBM Corporation)
iNEMI project: Electromigration of SiBn Solder for Second-Level Interconnect