Advancing Manufacturing Technology

Event Calendar

Wednesday, October 27, 2021

Packaging Tech Topic Series: Status and Trends in Fan-Out Wafer and Panel-Level Packaging

Start Date: 10/27/2021 9:00 AM EDT
End Date: 10/27/2021 10:00 AM EDT

Location:
United States 

Organization Name: iNEMI

Contact:
Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

Wednesday, October 27, 2021
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Open to members and non-members
Register for this webinar

 
Abstract: Status and Trends in Fan-Out Wafer and Panel-Level Packaging

Fan-out wafer (FOWLP) and panel-level packaging (PLP) are gaining relevance as mass compatible advanced packaging technologies. Providing technical advantages and optimized cost for manifold applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. In the past OSATs dominated high-volume manufacturing, but new players in packaging as semiconductor foundries, PCB or LCD manufacturing companies have recently entered this business area and are changing supply chains and moving toward larger form factors. This presentation will highlight recent technical developments as well as the changing ecosystem and actual business scenarios including the move to panel-level manufacturing.
 
 
About the Speaker

Dr. Tanja Braun
Fraunhofer IZM

Tanja Braun is head of the Assembly & Encapsulation Technologies Group for Fraunhofer IZM. Her recent research is focused on fan-out wafer and panel-level packaging technologies and Tanja is leading the Fan-out Panel Level Packaging Consortium at Fraunhofer IZM Berlin.
Results of her research concerning packaging for advanced packages have been presented at multiple international conferences. 
 
Tanja holds several patents in the field of advanced packaging and she received the Fraunhofer IZM research award in 2014. Tanja is an active member of IEEE, serving on the IEEE Electronics Packaging Society (EPS) Board of Governor (BOG), as Program Director of IEEE EPS Region 8, and is member of the IEEE EPS technical chapter, “Materials & Processing.“  In 2021, Tanja received the Exceptional Technical Achievement Award from IEEE Electronics Packaging Society (EPS) for her pioneering contributions as well as leadership in fan-out wafer level packaging and the transition to panel-level packaging. Her activities in this area encompass, among others, the establishment of the first international large-scale PLP reference line for R&D, as well as the initiation and organization of the Panel Level Consortium with 17 industry partners, which is currently in its second phase (PLC2.0).
 
Tanja studied mechanical engineering at Technical University of Berlin with a focus on polymers and microsystems and joined Fraunhofer IZM in 1999. In 2013 she received her doctorate from the Technical University of Berlin for work focusing on humidity diffusion through particle-filled epoxy resins.
 
 
 
 
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