Event Calendar

Thursday, October 27, 2022

iNEMI Presentation at IMPACT 2022

Start Date: 10/27/2022 10:00 AM HKT
End Date: 10/27/2022 12:00 PM HKT

Venue Name: Taipei Nangang Exhibition Center


Organization Name: iNEMI

Grace O'Malley
Email: infohelp@inemi.org
Phone: (984) 333-0820

The Effects of Voids on Solder Joint Reliability in First Level Interconnect,” will be presented by Sze Pei Lim (Indium), representing iNEMI’s 1st Level Interconnect Void Characterization project at the International Microsystems, Packaging, Assembly and Circuits Technology (IMPACT) conference. The presentation is part of session S12: Advanced Bonding and Interconnect Technology on October 27.
S12: Advanced Bonding and Interconnect Technology
October 27 / 10:00 a.m. — 12:00 p.m. / Room R503
iNEMI is a co-organizer of this event.