Event Calendar

Start Date: 10/9/2023 8:00 AM CDT
End Date: 10/12/2023 5:00 PM CDT

Location:

Organization Name: iNEMI

Contact:

 











Papers from three iNEMI projects will be presented at this year’s SMTA International conference (October 9-12 in Minneapolis, Minnesota). Be sure to check out these sessions if you plan to be at the conference.
 
 

Tuesday, October 10

 
Session IRR1*: Programs Addressing High Reliability and Mission Critical Applications
*Interconnect Research and Reliability
11:00 a.m. — 12:30 p.m.
Room 200 D/E
 
11:00-11:30 a.m.
A Collaborative Consortia Project to Assess the Effect of Thermal Cycling Dwell Time on the Reliability of High-Performance Solder Alloys
Richard Coyle,PhD, Nokia Bell Labs
(iNEMI project: Characterization of Third Generation High-Reliability Pb-Free Alloys)

 

Wednesday, October 11

 
Session LTS1: Thermal Cycling Performance of LT Sn-Bi Solder Joints with and without Aging
8:30-10:00 a.m.
Room 200 D/E
 
9:00-9:30 a.m.
The Effect of Thermal Cycling Profile on Thermal Fatigue Performance of an 84-Pin Thin Core BGA with Hybrid, Homogeneous, and Resin Reinforced Low Temperature Solder Interconnects
Raiyo Aspandiar, Ph.D., and Dan Burkholder, Intel Corporation
(iNEMI project: BiSn-Based Low-Temperature Soldering Process and Reliability)
 

Session LTS3: Electromigration, Shear and Drop Shock Assessment of Low Temperature Sn-Bi Solder Joints
2:00-4:00 p.m.
Room 200 D/E
 
2:00-2:30 p.m.
Comparison of Electromigration in TIN-Bismuth Planar and Bottom Terminated Component Solder Joints
Prabjit Singh, Ph.D., IBM Corporation
(iNEMI project: Electromigration of SnBi Solder for Second-Level Interconnect)