Event Calendar

Tuesday, October 17, 2023

iNEMI LTS Tech Topic Series: Electromigration in Tin-Bismuth Planar Solder Joints - Session 1

Start Date: 10/17/2023 10:00 AM EDT
End Date: 10/17/2023 11:00 AM EDT

United States 

Organization Name: iNEMI

Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

Session 1
Tuesday, October 17, 2023
10:00-11:00 a.m. EDT (Americas)
4:00-5:00 p.m. CEST (Europe)
10:00-11:00 p.m. CST (China)
Register for this webinar
Session 2
Wednesday, October 18, 2023
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EDT (Americas) on October 17
Register for this webinar
iNEMI is launching a series of webinars focused on low temperature solder (LTS). This first webinar in the series will share information from iNEMI’s Electromigration in SnBi Solder for Second-Level Interconnect project, which is determining the effects of joint height, temperature, current density and PCB finishes on solder joint reliably over a product’s life.
The low melting temperature (138°C) of Sn-Bi alloys make it attractive for assembling the thermally warpage-prone high-density microelectronic packaging that is becoming so commonplace today. However, Bi has high propensity for electromigration and segregation at the anode under high current density conditions, leading to potentially brittle solder joints with high electrical resistance with time in field.
This webinar will summarize Phase 1 results regarding electromigration in planar geometry solder joints that provide a novel way of studying electromigration in low-temperature solders such as eutectic SnBi. The novelty of the approach is that the plane solder joints bridging copper traces on printed circuit boards allow the metallurgical and electromigration phenomena to be directly and non-destructively observed while monitoring the resistance changes in the solder joints.
This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content). If you have any questions, please contact Haley Fu (haley.fu@inemi.org).