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Wednesday, December 6, 2023

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2023 UCLA CHIPS Workshop

Start Date: 12/6/2023 8:00 AM PST
End Date: 12/6/2023 6:00 PM PST

Location:

Los Angeles, CA United States

Organization Name: iNEMI

Contact:

Kaitlyn Turner
Email: kturner@inemi.org
Phone: (984) 333-0820

2023 UCLA CHIPS Workshop
8:00 am PST to 6:00 pm PST, December 6, 2023
Los Angeles

Panel Discussion: The Role of Roadmaps in Advanced Packaging
11:30 AM - 12:30 PM
George Orji – NIST (Moderator)
Shekhar Chandrashekhar – iNEMI
Tim Lee – Boeing
Venky Sundaram – SAP
TBD – SRC
Eric Forsythe – NIST

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Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

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iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

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Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

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Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education

11:00 AM to 12:00 PM EDT
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Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering

10:00 AM to 11:00 AM JST

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2023 UCLA CHIPS Workshop

Add to my calendar

Map

Upcoming Events

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Defining Circularity

iNEMI Packaging Interconnect Material Technology Series: Properties of Sn-Bi Low-Temperature Solders

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Economic Incentives

Kick-Off of iNEMI/IPC Working Group to Address Circularity Challenges: Expertise and Education

Packaging Interconnect Material Technology: Transient Liquid Phase Bonding For High-Temp Soldering