Event Calendar

Wednesday, December 7, 2022

Call-for-Participation Webinar: Hybrid PCBs for Next Generation Applications

Start Date: 12/7/2022 12:00 PM EST
End Date: 12/7/2022 1:00 PM EST

Location:
United States 

Organization Name: iNEMI

Contact:
Steve Payne
Email: steve.payne@inemi.org
Phone: (984) 333-0820

Wednesday, December 7, 2022
12:00-1:00 p.m. EST (US)
9:00-10:00 a.m. PST (US)
6:00-7:00 p.m. CET (Europe)
Register for this webinar

Contact: Steve Payne
steve.payne@inemi.org

Background
An increasing range of high-speed applications require low loss dielectric laminate materials within a printed circuit board (PCB) stack-up to achieve the required electrical performance. However, low loss laminate materials are more expensive than standard loss materials. One solution to minimize cost is to selectively use lower loss material on only the layers that require higher performance and use cheaper material on layers that do not require high performance. This “hybrid” combination of laminate materials can provide the required electrical performance at minimum cost, but the combination of dissimilar dielectric materials has associated challenges for PCB fabrication that can negatively impact reliability if manufacturing processes are not optimized and/or the materials are in some way incompatible.
 
According to an iNEMI survey, determining material compatibility and minimizing warpage are among the greatest challenges in hybrid PCB manufacturing. iNEMI’s Hybrid PCBs for Next Generation Applications project, led by Sarah Czaplewski (IBM) and Steven Ethridge (Dell), will evaluate how placement of dielectric materials with dissimilar properties within a hybrid stack-up impacts PCB thermomechanical performance using a commercially available simulation software. The team will study the impact of the following parameters on via hole reliability and PCB warpage: 
 

  • Material placement within a symmetrical hybrid stack-up with materials having different properties such as CTE and/or gel point
  • Various ratios of dissimilar dielectric materials in a symmetrical hybrid stack-up (i.e., 25% material A & 75% material B; 50% material A & 50% material B, etc.)
  • Resin asymmetry in the stack-up
The results of this project will increase understanding of how hybrid stack-up designs influence PCB thermomechanical performance. OEMs and PCB manufacturers may use this information to improve stack-up designs to be more robust and reliable as well as reduce the number of design and test iterations, thereby saving cost and development time. Laminate manufacturers may use this information to help tailor resin systems for use in hybrid constructions to better support customer needs.