Event Calendar

Tuesday, December 13, 2022

iNEMI Packaging Tech Topic Webinar: Use of Hybrid Bonding for Next Generation Electronics

Start Date: 12/13/2022 8:00 AM EST
End Date: 12/13/2022 9:00 AM EST

Location:
United States 

Organization Name: iNEMI

Contact:
Masahiro Tsuriya
Email: m.tsuriya@inemi.org
Phone: (984) 333-0820

iNEMI Packaging Tech Topic Webinar: Challenges and Equipment Solutions to Enable Next Generation Electronic Systems using Hybrid Bonding
Guest Speaker: Chris Scanlan, Besi Switzerland AG
 
Tuesday, December 13, 2022
8:00-9:00 a.m. EST (U.S.)
2:00-3:00 p.m. CET (Europe)
9:00-10:00 p.m. CST (China)
Register for this webinar
 
This webinar is open to industry; advance registration is required. For additional information, contact Masahiro Tsuriya (m.tsuriya@inemi.org).
 
Abstract
Advanced interconnect technology is becoming ever more prominent in the development of leading edge electronic systems. Chiplet architectures and advanced SiP devices require integration of multiple chips with advanced, fine pitch interfaces. Chip-to-wafer hybrid bonding is a new interconnection technology that provides extremely high interconnect density fiplets. This presentation will discuss some of the challenges and equipment solutions to enable next generation electronic systems using hybrid bonding and other advanced interconnect methods.
 
About the Speaker
Chris Scanlan is Senior Vice President Technology at Besi where he is leading advanced technology roadmap development and technical promotion. Prior to joining Vice President of Worldwide Applications Engineering at JCET Group where he was responsible for business development, technical program management, and product design. From 2009 to 2019 he was SVP of Product Development at Deca Technologies, a wafer level packaging technology provider. As a founding member of Deca, Chris was primarily responsible for the development of Deca’s portfolio of intellectual property and technology relating to M-Series fan-out, Adaptive Patterning and advanced wafer-level manufacturing methods. Chris worked at Amkor Technology for 10 years where he held leadership positions including VP of Global R&D, VP of the Advanced Products business unit and VP of the System-in-Package business unit. Chris started his career at Motorola Semiconductor where we developed a manufacturing line for high power IGBT modules, and managed the transfer of Motorola’s fcCSP technology from R&D to production. He has 70 issued US patents related to semiconductor packaging. He earned his Master of Science degree in Materials Engineering from the University of Wisconsin-Milwaukee.