Event Calendar

Wednesday, December 15, 2021

End-of-Project Webinar: iNEMI Package Warpage Prediction and Characterization Project, Session 2

Start Date: 12/15/2021 9:00 AM HKT
End Date: 12/15/2021 10:00 AM HKT

Location:
China 

Session 2
Wednesday, December 15, 2021 
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (Americas) on December 14
Register for this webinar


Abstract
Package warpage modeling is challenging as it requires significant consideration of material properties, multi-physics and boundary conditions. The iNEMI Package Warpage Prediction and Characterization project focused on development of a reliable modelling framework to predict dynamic warpage in new packages. 

Based on the modeling framework gap analysis and simulation case study from an earlier project, the team further investigated organic substrate-based packages. To understand the impact of curing processes on package warpage, the team conducted experiments on bi-material wafers with silicon and polymer, and characterized material properties, including those of mold compounds and substrate raw materials. Dynamic warpage was measured to compare with the experimental results for validation and modeling improvement. The project used Moldex3D and finite element analysis (FEA) tools in the experiments, expecting the use of different simulation tools would help the team understand the different physics assumptions. 

This webinar will summarize project results, highlight conclusions, and discuss future opportunities.

Registration
This webinar is open to industry; advance registration is required. If you have any questions, please contact Haley Fu (haley.fu@inemi.org).

Session 1 
Tuesday, December 14, 2021 
8:00-9:00 a.m. EST (Americas)
2:00-3:00 p.m. CET (Europe)
9:00-10:00 p.m. CST (China)
Register for this webinar