Event Calendar

Start Date: 2/14/2023 2:30 PM PST
End Date: 2/16/2023 3:30 PM PST

Location:

Organization Name: iNEMI

Contact:

SMTA Wafer-Level Packaging Symposium
February 14-16, 2023 | Fremont, California
https://smta.org/mpage/wafer
 
 
Wednesday, February 14 / 2:30 p.m.
Session 2: Advanced Manufacturing and Test / Test Metrology for Advanced Manufacturing
 

• “RDL Adhesion Study for Advanced Packages,” presented by Steven Martell (Nordson). This presentation is based on information from iNEMI’s RDL Adhesion Strength Measurement Project. 

 
 
Thursday, February 16 / 1:30 p.m.
Session 6: Wafer-Level Packaging / Novel WLP Technology Roadmap and Dielectric Systems

• “iNEMI Advanced Packaging Roadmapping and Challenges Ahead,” presented by Shekhar Chandrashekhar (iNEMI) and Dan Gamota (Jabil). Get additional details about the iNEMI Roadmap.