Event Calendar

Tuesday, February 27, 2024

LTS Tech Topic Series: Thermal Fatigue Performance in BiSn Based Low Temperature Solder Joints - S2

Start Date: 2/27/2024 10:00 AM EST
End Date: 2/27/2024 11:00 AM EST

Location:
United States 

Organization Name: iNEMI

Contact:
Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

Focus of Webinar
 
There is an increasing interest in many market segments to use solder alloys with lower melting temperatures for electronics assembly. Low temperature solders can provide manufacturing, economic, and environmental benefits. Since 2015, the iNEMI BiSn-Based Low-Temperature Soldering Process and Reliability Project has been evaluating low-temperature solder (LTS) paste formulations based on the Bi-Sn system. This webinar will report the results and lessons learned from the thermal cycling test of low-temperature solders completed to date.
 
Three types of LTS solder joints are evaluated: homogeneous, hybrid (heterogeneous), and hybrid formed with joint reinforced pastes (JRP).  Hybrid joints have an SAC BGA soldered with a ductile metallurgy LTS solder paste. The test includes two distinct accelerated temperature cycling (ATC) profiles, 0/100°C (IPC-9701B, TC1) and -15/85°C (selected due to the homologous temperature comparison between Sn-Ag-Cu and Bi-Sn solder), using two daisy-chained BGA test vehicles, a 192-pin chip array BGA (CABGA192) and an 84-pin thin core BGA (CTBGA84).
 
 
About the Speaker
Richard Coyle, PhD
Consulting Member of the Technical Staff
Nokia Bell Labs
 
Richard Coyle is widely recognized in the industry for his expertise in metallurgy and electronics material science. He began his career at Bell Labs approximately 30 years ago with research spanning areas such as laser materials processing and electronics materials processing. His work both on the reliability, and the critical understanding of the structural property relations of solders is well recognized across the industry. He currently leads root cause analyses, advanced reliability risk assessments, attachment reliability testing of electronic assemblies, and experimental studies of emerging Pb-free solder alloys as part of the Nokia Bell Labs Reliability organization. He has a long history of participation and leadership positions in industry consortia and associations, including serving as a member of the iNEMI Board of Directors since 2018. He was named an iNEMI Fellow in 2023.
 
In addition, Richard is a past member of the and SMTA Board of Directors where he served as the Vice President of Technical Programs, and currently is the Co-Director of the SMTA International Conference. He also currently chairs iNEMI’s Characterization of Third Generation High-Reliability Pb-Free Alloys and the QFN Package Board Level Reliability projects. He is a member of TMS, ASM International, the IEEE-EPS, IMAPS, SMTA, and AWS. Richard received his Ph.D. in Metallurgical Engineering and Materials Science from the University of Notre Dame.
 
 
Registration
This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content). If you have any questions, please contact Haley Fu (haley.fu@inemi.org).

Session 2
Tuesday, February 27, 2023
10:00-11:00 a.m. EST (US)
4:00-5:00 p.m. CET (Europe)
11:00 p.m.-12:00 a.m. CST (China)
Register for this webinar

Session 1
Tuesday, February 20, 2024
9:00-10:00 a.m. CST (China)
8:00-9:00 p.m. EST (US) on February 19
Register for this webinar

  
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