Start Date: 7/15/2021 11:00 AM EDT
End Date: 7/15/2021 12:00 PM EDT
11:00 a.m.—12:00 p.m. EDT (Americas)
5:00—6:00 p.m. CEST (Europe)
11:00-12:00 p.m. CST (China)
Thin glass substrates with fine-pitch through-glass via (TGV) technology provides attractive solutions for 5G, wafer level packaging and systems integration. High quality glass can be formed in very thin sheets (<100 um thick), which enables solutions with small footprint, and eliminates the need for back-grinding operations. Electrical and physical properties of glass have many attractive attributes such as low RF loss, the ability to adjust thermal expansion properties, low roughness with excellent flatness to achieve fine L/S. Furthermore, glass can be fabricated in panel format to reduce manufacturing costs. The biggest challenge to adopting glass as a packaging substrate has been the existence of gaps in the supply chain, caused primarily by the difficulty in handling large, thin glass substrates using standard automation and processing equipment. This paper presents the Viaffirm™ temporary bonding technology that allows the thin glass substrates to be processed in a semiconductor fab environment without the need to modify existing equipment. We will present use cases demonstrating key manufacturing and performance advantages of leveraging the approach to enable low loss glass-based solutions.
About the Speaker
Aric Shorey, Mosaic Microsystems
Aric Shorey, PhD, is the Vice President of Business Development at Mosaic Microsystems, a company with a primary focus on enabling the use of thin glass substrates in microelectronics and photonics packaging. He has been in the precision optics, telecommunications and semiconductor industries for more than 20 years leading activities in materials processing, characterization and program management. Before Mosaic, Aric was at Corning Incorporated for 10 years, leading activities to enable thin glass solutions for microelectronics applications. Aric has an MS in mechanical engineering and PhD in Materials Science from the University of Rochester.