Advancing Manufacturing Technology

Event Calendar

Thursday, January 20, 2022

Call for Participation: Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4 — Session 1

Start Date: 1/20/2022 8:00 AM EST
End Date: 1/20/2022 9:00 AM EST

NC  United States 

Session 1 (Americas/Europe/APAC) 
Thursday, January 20 
8:00-9:00 a.m. EST (Americas) 
2:00-3:00 p.m. CET (Europe)
10:00-11:00 p.m. JST (Japan) 
Register for this webinar

Heterogeneous SiP packages are increasingly being used as an electronic packaging solution and these packages require finer circuitry patterns designed within the substrate/interposer (lines and spaces <10um). These fine pitch substrates/interposers plus larger panel sizes and more layers on substrates demand increased AOI capability to accurately detect, characterize and reject the true defects without over-rejections. Finer trace width and spaces will need better AOI optics to reduce the field of view and depth of focus while addressing warpage issues and organic panel shrinkage. 

iNEMI’s new Panel Level Package Fine Pitch Substrate Inspection/Metrology Project, Phase 4  will study defect detection plus line width and space measurement for circuit patterns below 5um line space. This project will provide a better understanding of current AOI measurement and inspection systems and the latest technology trends for AOI solutions. The ultimate goal of this project is to drive the readiness of innovative AOI inspection systems to reduce the defect escape risk for finer pattern substrate and interposers. 

Session 2 (APAC/Americas)
Friday, January 21
10:00-11:00 a.m. JST (Japan) 
5:00-6:00 p.m. PST (Americas) on Thursday, January 20
Register for this webinar