Event Calendar

Friday, June 3, 2022

iNEMI Presentation at ECTC 2022

Start Date: 6/3/2022 8:00 AM PDT
End Date: 6/3/2022 11:00 AM PDT

Venue Name: 2022 IEEE 72nd Electronic Components and Technology Conference

Location:
San Diego, CA  United States 

2022 IEEE 72nd Electronic Components
and Technology Conference

May 31 — June 3, 2022 / San Diego, California


Friday, June 3
Session 26: Soldered and Sintered Interconnections
8:00 — 11:40 a.m.
Room: Silver Pearl 2


Paper: Influence of Micro-Voids in Flip Chip Bump on Electromigration Reliability
Presenter: Kei Murayama (Shinko)
This presentation is based on the work of iNEMI’s First Level Interconnect Void Characterization project