Start Date: 12/8/2022 10:20 AM HKT
End Date: 12/9/2022 4:05 PM HKT
Venue Name: Grand Copthorne Waterfront Hotel Location:
Thursday, December 8?
Session B6: Soldered and Sintered Interconnections II
10:20-11:40 a.m., Riverfront III
In this session, Sze Pei Lim (Indium Corporation Malaysia) will present "Low Temperature Material for 1st Level Interconnect in Semiconductor Packaging" (Session B6.3, 11:00-11:20 a.m.)
Co-authors are: Charles Arvin (IBM Corporation), Keith Sweatman (Nihon Superior Co. Ltd.) and Masahiro Tsuriya (iNEMI). Get additional information about the project.
Friday, December 9
Interactive Presentations 2
2:35-4:05 p.m.; Waterfront Foyer
#204 — Mechanical Simulation & Characterization
"High Density Interconnect Socket Warpage Prediction and Characterization," Renn Chan Ooi (Intel Corp, Malaysia)
NOTE: this is an interactive session with a paper, poster and recorded presentation.
Co-authors are: Franco Costa (Autodesk, Inc.); Sam Hsieh and Ethan Chiu (Coretech Systems Co. Ltd); Wendy Xu, Dave Yu and Darwin Fan (Celanese); Allen Cheng and Andrew Gattuso (Foxconn Interconnect Technology); Yongfu Wang and Currey Hsieh (Lotes Co. Ltd.); Jeffery Toran and John Thompson (Amphenol); Pierre-Louis Toussaint (Insidix); Ryan Curry (Akrometrix Inc.); Wei Keat Loh (Intel Corporation, Malaysia); Ron Kulterman (Flextronics Ltd.); and Haley Fu (iNEMI)
Get additional information about the project