Event Calendar

Thursday, February 9, 2023

NIST 5G/6G MAESTRO Workshop

Start Date: 2/9/2023 12:00 PM EST
End Date: 2/9/2023 1:30 PM EST

Location:
United States 

Organization Name: iNEMI

Contact:
Urmi Ray
Email: urmi.ray@inemi.org
Phone: (984) 333-0820

Thursday February 9, 2023
9:00-10:30 a.m. PST (US)
12:00-1:30 p.m. EST (US)
6:00-7:30 p.m. CST (Europe)
Register for this webinar


iNEMI, along with several partners, is developing the 5G/6G mmWave Materials and Electrical Test Technology (5G/6G MAESTRO) as part of the NIST Advanced Manufacturing Technology (MfgTech) Roadmap. The goal of MAESTRO is to create a foundation of knowledge and expertise in the U.S. to support the development and manufacturing of leading edge 5G and 6G products. This webinar will provide an introduction to the roadmap and a status update, including highlights of progress to date.
 


Agenda

Time (PST) Topic Speaker
9:00 – 9:15 a.m.
5G/6G MAESTRO Introduction
Urmi Ray, iNEMI
9:15 – 9:45 a.m.
Identification of Next Generation Dielectric Materials and Testing Needs
David Citrin, Georgia Tech
9:45 – 10:15 a.m.
mmWave System Design Analysis: Trends and Recommendations
Raj Pulugurtha, FIU

10:15 – 10:30 a.m.

Q&A

Urmi Ray, iNEMI
 

*Abstracts

MAESTRO Roadmap Introduction
The iNEMI team has been entrusted with developing a comprehensive NIST Advanced Manufacturing Technology (MfgTech) Roadmap on the topic of 5G/6G mmWave Materials and Electrical Test Technology (5G/6G MAESTRO). The goal of this technology roadmap is to create in the U.S. a world-leading knowledge base and technical know-how in mmWave material selection, characterization and test – the first necessary foundation for the development and manufacturing of leading edge 5G and 6G products with the highest radio performance. This presentation will provide an introduction to the roadmap creation, and provide a status, including highlights of the progress to date.


Identification of Next Generation Dielectric Materials and Testing Needs 
Exploitation of the 5G and 6G bands places stringent demands on the dielectric properties of materials for device and packaging applications.  Losses often scale with frequency in a way that makes the choice of packaging materials in the terahertz band difficult.  We discuss the challenges faced in the 5G and 6G bands related to dielectric properties with a focus on device and packaging materials and an eye on the next 10 to 15 years.  We also address problems faced with the precise and accurate measurement of dielectric properties in the mmWave and terahertz bands, with a concentration above 300 GHz.   We aim to provide a status report on dielectric properties together with suggestions where work is needed to move into the 5G and 6G bands.

mmWave System Design Analysis: Trends and Recommendations 
This presentation will discuss key advances in system architectures and package integration that will enable future mmWave systems. Beamforming architectures as the key design building block for high-gain massive MIMO communications will be reviewed in the first part. Various architectures will be classified to compare their advantages and disadvantages. The reduction in system complexity and overall power consumption through hardware simplification with digital beamforming will be discussed. Passive integration to lower interconnect parasitics is the next critical block for functions such as filters, beamsplitters or power dividers, interference cancellation and others. The use of various Intelligent Reactive Surfaces (IRS) to further improve spectral efficiency will be discussed in this section. Antenna integration in packages will active-passive integration of transceiver ICs, passives and beamforming will be discussed in the following subsections. The last part discusses various mmWave imaging approaches as a key future application for 5G technologies. 
 


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