Event Calendar

Wednesday, April 19, 2023

iNEMI Session at ICEP 2023

Start Date: 4/19/2023 9:30 AM JST
End Date: 4/19/2023 11:15 AM JST


Organization Name: iNEMI

Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

2023 International Conference on Electronics Packaging (ICEP)
April 19-22; (Kumamoto Pref., Kyushu area, Japan)
WA1: iNEMI Session
Wednesday, April 19
9:30-11:10 a.m., Room A

  • (WA1-1) Preparing for 6G: Developing Best Practices and Standards for Industrial Measurements of Low-Loss Dielectrics, Lucas Enright (NIST) 
  • (WA1-2) AOI Pattern Detection Study for Fine Pitch Advanced Substrate, Feng Xue (IBM)
  • (WA1-3) Adhesion Measurement Study for Advanced Substrate Circuitry Patterns, Masahiro Tsuriya (iNEMI)
  • (WA1-4) An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305, Sze Pei Lim (Indium)