Event Calendar

Start Date: 4/19/2023 9:30 AM JST
End Date: 4/19/2023 11:15 AM JST

Location:

Organization Name: iNEMI

Contact:

2023 International Conference on Electronics Packaging (ICEP)
April 19-22; (Kumamoto Pref., Kyushu area, Japan)
 
 
WA1: iNEMI Session
Wednesday, April 19
9:30-11:10 a.m., Room A
 

• (WA1-1) Preparing for 6G: Developing Best Practices and Standards for Industrial Measurements of Low-Loss Dielectrics, Lucas Enright (NIST) 

• (WA1-2) AOI Pattern Detection Study for Fine Pitch Advanced Substrate, Feng Xue (IBM)
   
• (WA1-3) Adhesion Measurement Study for Advanced Substrate Circuitry Patterns, Masahiro Tsuriya (iNEMI)
   
• (WA1-4) An In-containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305, Sze Pei Lim (Indium)