Event Calendar

Start Date: 10/18/2023 9:00 AM HKT
End Date: 10/18/2023 10:00 AM HKT

Location:

Organization Name: iNEMI

Contact:

Session 2
Wednesday, October 18, 2023
9:00-10:00 a.m. CST (China)
9:00-10:00 p.m. EST (Americas) on October 17
Register for this webinar

Session 1
Tuesday, October 17, 2023
10:00-11:00 a.m. EST (Americas)
4:00-5:00 p.m. CET (Europe)
10:00-11:00 p.m. CST (China)
Register for this webinar
 
Introduction
iNEMI is launching a series of webinars focused on low temperature solder (LTS). This first webinar in the series will share information from iNEMI’s Electromigration in SnBi Solder for Second-Level Interconnect project, which is determining the effects of joint height, temperature, current density and PCB finishes on solder joint reliably over a product’s life.
 
The low melting temperature (138°C) of Sn-Bi alloys make it attractive for assembling the thermally warpage-prone high-density microelectronic packaging that is becoming so commonplace today. However, Bi has high propensity for electromigration and segregation at the anode under high current density conditions, leading to potentially brittle solder joints with high electrical resistance with time in field.
 
This webinar will summarize Phase 1 results regarding electromigration in planar geometry solder joints that provide a novel way of studying electromigration in low-temperature solders such as eutectic SnBi. The novelty of the approach is that the plane solder joints bridging copper traces on printed circuit boards allow the metallurgical and electromigration phenomena to be directly and non-destructively observed while monitoring the resistance changes in the solder joints.
 
Registration
This webinar is open to industry; advance registration is required. Two sessions are scheduled (with the same content). If you have any questions, please contact Haley Fu (haley.fu@inemi.org).