Start Date: 2/14/2024 2:30 PM PST
End Date: 2/14/2024 4:30 PM PST
Burlingame, CA United States
SMTA Wafer-Level Packaging Symposium
February 13-15, 2024
Burlingame, California USA
Wednesday, February 14
Session 6 - Developments in FO Process & RDL Reliability
“Update on RDL Adhesion Measurement Study for WLPs”
Presented by Steve Martell, Nordson
This presentation will provide an update from iNEMI’s RDL Adhesion Strength Measurement project, which is evaluating adhesion strength measurement methodologies and characterizing RDL mechanical performances for narrow trace widths. It is also identifying potential common requirements for key material properties so that the industry is better aligned on qualification requirements.
Be sure to check out this session if you plan to be at this year's symposium!