Event Calendar

Thursday, April 18, 2024

iNEMI Session at ICEP 2024

Start Date: 4/18/2024 9:45 AM JST
End Date: 4/18/2024 10:30 AM JST

Toyama, Japan 

Organization Name: iNEMI

Haley Fu
Email: haley.fu@inemi.org
Phone: (984) 333-0820

2024 International Conference on Electronics Packaging (ICEP)
April 17-20, 2024
Toyama, Japan
See advance program.

If you plan to be at ICEP this year, be sure to join us for the iNEMI session.

TA1: iNEMI Session
Thursday, April 18, 2024
9:40-11:20 a.m.
TA1-1 Electromigation in Eutectic Tin-Bismuth Alloys With Third Component Metallic Elements
Presenter: Prabjit Singh, IBM
iNEMI project: Electromigration of SnBi Solder for Second-Level Interconnect
TA1-2 Adhesion Characterization of Redistribution Layer
Presenter: Kor Oon Lee, Intel / Malaysia
iNEMI project: RDL Adhesion Strength Measurement
TA1-3 High Temperature Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
Presenter: Ian Chin, Intel Microelectronics
iNEMI project: Moisture Induced Expansion Metrology for Packaging Polymetric Materials, Phase 1
TA1-4 Low Temperature Material Discovery and Readiness for 1st Level Interconnect in Semiconductor Packaging
Presenter: Sze Pei Lim, Indium / Malaysia
iNEMI project: Low Temperature Material Discovery and Characterization for First Level Interconnect