Event Calendar

Tuesday, June 18, 2024

iNEMI Packaging Tech Topic Webinar: Advanced Packaging Focusing on 2.5D/3D Packaging

Start Date: 6/18/2024 9:00 AM EDT
End Date: 6/18/2024 10:00 AM EDT

United States 

Guest Speaker: Yik Yee Tan, PhD, Yole Group



5G applications, artificial intelligence (AI), and high-performance computing are demanding greater performance, lower latency, increased bandwidth and improved power efficiency from semiconductor devices. 2.5D/3D packaging is a viable solution to help meet many of those needs. AI, for example, demands higher transmission speeds and bandwidths, and offers considerable opportunities for the adoption of 2.5D/3D packaging. 

2.5D/3D packaging requires significant innovation in technologies, processes, materials and tools throughout the supply chain. There have been various options offered by different technology providers to meet the potential bottleneck caused by higher density and lower line/space pitch requirements.  

Yole Group is well known for its analysis of market and technology trends, including semiconductor manufacturing and advanced packaging. This presentation will give an overview of 2.5D/3D market trends and examples of technology trends seen among some of the key players. It will also discuss the challenges of 2.5D/3D packaging, innovations anticipated for the future and what the next emerging packaging trend might be after 2.5D/3D.


About the Speaker

Yik Yee Tan, PhD, is a Senior Technology & Market Analyst, Semiconductor Packaging at Yole Group, within the Semiconductor Manufacturing & Global Supply Chain Business Line. She has more than 25 years of experience in semiconductor packaging. Based on her technical expertise and market knowledge, she develops technology and market reports and is engaged in dedicated custom projects. Prior to Yole, Dr. Tan worked as a failure analyst and interconnect principal at Infineon Technologies (Malaysia) and later as an open innovation senior manager at onsemi (Malaysia). While at onsemi, she was deeply involved in numerous innovative advanced packaging projects. Dr. Tan has published more than 30 papers and hold 3 patents. She received her Ph.D. in Engineering from Multimedia University (MMU, Malaysia).


This webinar is open to industry; advance registration is required (see link below). If you need additional information, please contact Masahiro Tsuriya (m.tsuriya@inemi.org). 

Tuesday, June 18, 2024 
9:00-10:00 a.m. EDT (Americas)
3:00-4:00 p.m. CEST (Europe)
10:00-11:00 p.m. JST (Japan)
Register for this webinar